Explore: Metallizing
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Source: The Open Library
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1Advanced metallizations in microelectronics
By Avishay Katz, S. P. Murarka and Shyam P. Murarka

“Advanced metallizations in microelectronics” Metadata:
- Title: ➤ Advanced metallizations in microelectronics
- Authors: Avishay KatzS. P. MurarkaShyam P. Murarka
- Language: English
- Number of Pages: Median: 633
- Publisher: ➤ Materials Research Society - University of Cambridge ESOL Examinations
- Publish Date: 1990 - 2014
- Publish Location: Pittsburgh, Pa
“Advanced metallizations in microelectronics” Subjects and Themes:
- Subjects: Metallizing - Congresses - Microelectronics - Science/Mathematics - Electronic Engineering (Specific Aspects)
Edition Identifiers:
- The Open Library ID: OL29205919M - OL8608749M - OL1881607M
- Online Computer Library Center (OCLC) ID: 22118726
- Library of Congress Control Number (LCCN): 90042268
- All ISBNs: 9781558990708 - 1558990704 - 1107410177 - 9781107410176
Access and General Info:
- First Year Published: 1990
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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2Materials Reliability in Microelectronics V (Symposium Proceedings Series; Volume 391)
By A. S. Oates

“Materials Reliability in Microelectronics V (Symposium Proceedings Series; Volume 391)” Metadata:
- Title: ➤ Materials Reliability in Microelectronics V (Symposium Proceedings Series; Volume 391)
- Author: A. S. Oates
- Language: English
- Number of Pages: Median: 523
- Publisher: Materials Research Society
- Publish Date: 1995
- Publish Location: Pittsburgh, Penn
“Materials Reliability in Microelectronics V (Symposium Proceedings Series; Volume 391)” Subjects and Themes:
- Subjects: ➤ Reliability - Congresses - Microstructure - Materials - Testing - Microelectronics - Electrodiffusion - Metallizing
Edition Identifiers:
- The Open Library ID: OL12091900M - OL21072894M
- Online Computer Library Center (OCLC) ID: 33816210
- All ISBNs: 1558992944 - 9781558992948
Access and General Info:
- First Year Published: 1995
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
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3Materials reliability in microelectronics VI
By Robert Rosenberg

“Materials reliability in microelectronics VI” Metadata:
- Title: ➤ Materials reliability in microelectronics VI
- Author: Robert Rosenberg
- Language: English
- Number of Pages: Median: 583
- Publisher: Materials Research Society
- Publish Date: 1996 - 1999
- Publish Location: Pittsburgh, Pa
“Materials reliability in microelectronics VI” Subjects and Themes:
- Subjects: ➤ Reliability - Congresses - Microstructure - Materials - Metallizing - Testing - Microelectronics - Materials, research - Mikroelektronik - Mikrostruktur - Zuverlässigkeit - Kongress
Edition Identifiers:
- The Open Library ID: OL19631721M - OL12091904M
- Online Computer Library Center (OCLC) ID: 36213786
- All ISBNs: 9781558993310 - 1558993312
Access and General Info:
- First Year Published: 1996
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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4Advanced metallization and processing for semiconductor devices and circuits--II
By Avishay Katz, Shyam P. Murarka and Yves I. Nissim

“Advanced metallization and processing for semiconductor devices and circuits--II” Metadata:
- Title: ➤ Advanced metallization and processing for semiconductor devices and circuits--II
- Authors: Avishay KatzShyam P. MurarkaYves I. Nissim
- Language: English
- Number of Pages: Median: 965
- Publisher: Materials Research Society
- Publish Date: 1992
- Publish Location: Pittsburgh, Pa
“Advanced metallization and processing for semiconductor devices and circuits--II” Subjects and Themes:
- Subjects: ➤ Vapor-plating - Metallic films - Compound semiconductors - Metallizing - Congresses - Thin films - Design and construction - Semiconductors - Electronics - Semiconductors - Technology & Industrial Arts - Science/Mathematics - Technology - Materials, research
Edition Identifiers:
- The Open Library ID: OL8608811M - OL1723075M
- Online Computer Library Center (OCLC) ID: 26364100
- Library of Congress Control Number (LCCN): 92026614
- All ISBNs: 1558991557 - 9781558991552
Access and General Info:
- First Year Published: 1992
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
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5Multilevel Interconnection
By Ronald Schutz and Joseph B. Bernstein

“Multilevel Interconnection” Metadata:
- Title: Multilevel Interconnection
- Authors: Ronald SchutzJoseph B. Bernstein
- Language: English
- Number of Pages: Median: 228
- Publisher: SPIE
- Publish Date: 1993
- Publish Location: Bellingham, Wash., USA
“Multilevel Interconnection” Subjects and Themes:
- Subjects: ➤ Integrated circuits, very large scale integration - Materials - Congresses - Very large scale integration - Metallizing - Integrated circuits - Design and construction
Edition Identifiers:
- The Open Library ID: OL1446793M
- Online Computer Library Center (OCLC) ID: 29019282
- Library of Congress Control Number (LCCN): 93086007
- All ISBNs: 9780819413611 - 0819413615
Access and General Info:
- First Year Published: 1993
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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6Metallization
By S. P. Murarka

“Metallization” Metadata:
- Title: Metallization
- Author: S. P. Murarka
- Language: English
- Number of Pages: Median: 250
- Publisher: Butterworth-Heinemann
- Publish Date: 1993
- Publish Location: Boston
“Metallization” Subjects and Themes:
- Subjects: Integrated circuits - Metallizing - Very large scale integration
Edition Identifiers:
- The Open Library ID: OL1729273M
- Library of Congress Control Number (LCCN): 92033603
- All ISBNs: 9780750690010 - 0750690011
Access and General Info:
- First Year Published: 1993
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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7Process, equipment, and materials control in integrated circuit manufacturing III

“Process, equipment, and materials control in integrated circuit manufacturing III” Metadata:
- Title: ➤ Process, equipment, and materials control in integrated circuit manufacturing III
- Language: English
- Number of Pages: Median: 270
- Publisher: SPIE
- Publish Date: 1997
- Publish Location: Bellingham, Washington
“Process, equipment, and materials control in integrated circuit manufacturing III” Subjects and Themes:
- Subjects: ➤ Congresses - Plasma etching - Dielectric films - Metallizing - Integrated circuits - Design and construction
Edition Identifiers:
- The Open Library ID: OL418375M
- Online Computer Library Center (OCLC) ID: 37731294 - 37743222
- Library of Congress Control Number (LCCN): 98122092
- All ISBNs: 0819426458 - 9780819426451
Access and General Info:
- First Year Published: 1997
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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8Process, equipment, and materials control in integrated circuit manufacturing
By Anant G. Sabnis

“Process, equipment, and materials control in integrated circuit manufacturing” Metadata:
- Title: ➤ Process, equipment, and materials control in integrated circuit manufacturing
- Author: Anant G. Sabnis
- Language: English
- Number of Pages: Median: 238
- Publisher: SPIE
- Publish Date: 1995
- Publish Location: Bellingham, Wash
“Process, equipment, and materials control in integrated circuit manufacturing” Subjects and Themes:
- Subjects: ➤ Congresses - Integrated circuits - Plasma etching - Integrated circuits industry - Metallizing - Manufacturing processes - Design and construction - Dielectric films
Edition Identifiers:
- The Open Library ID: OL819464M
- Online Computer Library Center (OCLC) ID: 33331897
- Library of Congress Control Number (LCCN): 95070380
- All ISBNs: 9780819420039 - 0819420034
Access and General Info:
- First Year Published: 1995
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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9Microelectronics technology and process integration
By S. P. Murarka

“Microelectronics technology and process integration” Metadata:
- Title: ➤ Microelectronics technology and process integration
- Author: S. P. Murarka
- Language: English
- Number of Pages: Median: 290
- Publisher: SPIE
- Publish Date: 1994
- Publish Location: Bellingham, Wash., USA
“Microelectronics technology and process integration” Subjects and Themes:
- Subjects: ➤ Congresses - Plasma etching - Dielectric films - Metallizing - Integrated circuits - Design and construction
Edition Identifiers:
- The Open Library ID: OL1125383M
- Online Computer Library Center (OCLC) ID: 31210232
- Library of Congress Control Number (LCCN): 94067261
- All ISBNs: 9780819416681 - 0819416681
Access and General Info:
- First Year Published: 1994
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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10Metallization
By Gennady Sh Gildenblat

“Metallization” Metadata:
- Title: Metallization
- Author: Gennady Sh Gildenblat
- Language: English
- Number of Pages: Median: 159
- Publisher: SPIE
- Publish Date: 1991
- Publish Location: Bellingham, Wash
“Metallization” Subjects and Themes:
- Subjects: ➤ Vapor-plating - Metallic films - Very large scale integration - Testing - Reliability - Congresses - Metallizing - Integrated circuits - Microlithography - Metal coating - Materials
Edition Identifiers:
- The Open Library ID: OL1572307M
- Online Computer Library Center (OCLC) ID: 25384158
- Library of Congress Control Number (LCCN): 91067549
- All ISBNs: 0819407275 - 9780819407276
Access and General Info:
- First Year Published: 1991
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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11Au/Zn contacts to [rho]-InP
By Victor G. Weizer
“Au/Zn contacts to [rho]-InP” Metadata:
- Title: Au/Zn contacts to [rho]-InP
- Author: Victor G. Weizer
- Language: English
- Publisher: ➤ National Technical Information Service, distributor - National Aeronautics and Space Administration
- Publish Date: 1994
- Publish Location: ➤ [Springfield, Va - [Washington, D.C.]
“Au/Zn contacts to [rho]-InP” Subjects and Themes:
- Subjects: Electric contacts - Gold - Indium phosphides - Metallizing - Zinc
Edition Identifiers:
- The Open Library ID: OL17105029M - OL17116546M - OL18084344M - OL15418828M
- Online Computer Library Center (OCLC) ID: 34063139
Access and General Info:
- First Year Published: 1994
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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12VLSI metallization
By Norman G. Einspruch, Simon S. Cohen and Gennady Sh Gildenblat

“VLSI metallization” Metadata:
- Title: VLSI metallization
- Authors: Norman G. EinspruchSimon S. CohenGennady Sh Gildenblat
- Language: English
- Number of Pages: Median: 480
- Publisher: ➤ Elsevier Science & Technology Books - Academic Press - Academic Pr
- Publish Date: 1987 - 2014
- Publish Location: Orlando
“VLSI metallization” Subjects and Themes:
- Subjects: Metallizing - Design and construction - Metallic films - Integrated circuits - Very large scale integration
Edition Identifiers:
- The Open Library ID: OL35788875M - OL9281290M - OL7326642M - OL2734432M
- Online Computer Library Center (OCLC) ID: 79191052
- Library of Congress Control Number (LCCN): 86028744
- All ISBNs: 1483217817 - 9781483217819 - 0122341155 - 9780122341151
Access and General Info:
- First Year Published: 1987
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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13Proceedings of the Flat-Plate Solar Array Project Research Forum on Photovoltaic Metallization Systems
By Flat-Plate Solar Array Project Research Forum on Photovoltaic Metallization Systems (1983 Pine Mountain, Ga.)
“Proceedings of the Flat-Plate Solar Array Project Research Forum on Photovoltaic Metallization Systems” Metadata:
- Title: ➤ Proceedings of the Flat-Plate Solar Array Project Research Forum on Photovoltaic Metallization Systems
- Author: ➤ Flat-Plate Solar Array Project Research Forum on Photovoltaic Metallization Systems (1983 Pine Mountain, Ga.)
- Language: English
- Publisher: ➤ Jet Propulsion Laboratory, California Institute of Technology
- Publish Date: 1983
- Publish Location: Pasadena, Calif
“Proceedings of the Flat-Plate Solar Array Project Research Forum on Photovoltaic Metallization Systems” Subjects and Themes:
- Subjects: ➤ Congresses - Solar cells - Photovoltaic power generation - Corrosion - Conferences - Photovoltaic cells - Metallizing - Particle size distribution - Solar collectors - Photovoltaic effect - Solar arrays
Edition Identifiers:
- The Open Library ID: OL17635894M - OL18295945M - OL16157172M
- Online Computer Library Center (OCLC) ID: 182779642
Access and General Info:
- First Year Published: 1983
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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14Copper-fundamental mechanisms for microelectronic applications
By S. P Murarka, Shyam P. Murarka, Igor V. Verner and Ronald J. Gutmann

“Copper-fundamental mechanisms for microelectronic applications” Metadata:
- Title: ➤ Copper-fundamental mechanisms for microelectronic applications
- Authors: S. P MurarkaShyam P. MurarkaIgor V. VernerRonald J. Gutmann
- Language: English
- Number of Pages: Median: 337
- Publisher: ➤ Wiley & Sons, Incorporated, John - John Wiley - Wiley-Interscience
- Publish Date: 2000 - 2008
- Publish Location: New York
“Copper-fundamental mechanisms for microelectronic applications” Subjects and Themes:
- Subjects: ➤ Semiconductors - Copper - Materials - Metallizing - Microelectronics - Junctions
Edition Identifiers:
- The Open Library ID: OL7614120M - OL16972105M - OL29229781M
- Library of Congress Control Number (LCCN): 99045535
- All ISBNs: 9780470347874 - 9780471252566 - 0470347872 - 0471252565
First Setence:
"One of the many important properties of metals is the low electrical resistivity, making them perhaps the most important materials to carry electrical current from one location to another separated by small or large distances."
Access and General Info:
- First Year Published: 2000
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Printdisabled
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15Stress-induced phenomena in metallization
By International Workshop on Stress-Induced Phenomena in Metallization (7th 2004 Austin, Tex.)

“Stress-induced phenomena in metallization” Metadata:
- Title: ➤ Stress-induced phenomena in metallization
- Author: ➤ International Workshop on Stress-Induced Phenomena in Metallization (7th 2004 Austin, Tex.)
- Language: English
- Number of Pages: Median: 272
- Publisher: American Institute of Physics
- Publish Date: 2004
- Publish Location: Melville, N.Y
“Stress-induced phenomena in metallization” Subjects and Themes:
- Subjects: ➤ Congresses - Copper - Damascening - Defects - Dielectric films - Electric properties - Electrodiffusion - Integrated circuits - Interconnects (Integrated circuit technology) - Metallic films - Metallizing - Semiconductors - Thin film devices - Aluminum films
Edition Identifiers:
- The Open Library ID: OL3316905M - OL7889638M
- Online Computer Library Center (OCLC) ID: 57340844
- Library of Congress Control Number (LCCN): 2004116273
- All ISBNs: 0735402256 - 9780735402256
Access and General Info:
- First Year Published: 2004
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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16Proceedings of the symposia on Patterning Science and Technology II [and] Interconnection and Contact Metallization for ULSI
By International Symposium on Patterning Science and Technology (2nd 1991 Phoenix, Ariz.)
“Proceedings of the symposia on Patterning Science and Technology II [and] Interconnection and Contact Metallization for ULSI” Metadata:
- Title: ➤ Proceedings of the symposia on Patterning Science and Technology II [and] Interconnection and Contact Metallization for ULSI
- Author: ➤ International Symposium on Patterning Science and Technology (2nd 1991 Phoenix, Ariz.)
- Language: English
- Number of Pages: Median: 382
- Publisher: Electrochemical Society
- Publish Date: 1992
- Publish Location: Pennington, NJ
“Proceedings of the symposia on Patterning Science and Technology II [and] Interconnection and Contact Metallization for ULSI” Subjects and Themes:
- Subjects: ➤ Congresses - Design and construction - Integrated circuits - Lithography - Metallizing - Microelectronic packaging - Ultra large scale integration - Microelectronics - Microlithography - Photoresists - Masks (Electronics) - Large scale integration
Edition Identifiers:
- The Open Library ID: OL8670964M - OL1749210M
- Online Computer Library Center (OCLC) ID: 502605458
- Library of Congress Control Number (LCCN): 92071002
- All ISBNs: 9781566770071 - 1566770076
Access and General Info:
- First Year Published: 1992
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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17Materials, integration and technology for monolithic instruments
By Jeremy A. Theil

“Materials, integration and technology for monolithic instruments” Metadata:
- Title: ➤ Materials, integration and technology for monolithic instruments
- Author: Jeremy A. Theil
- Language: English
- Number of Pages: Median: 179
- Publisher: ➤ Cambridge University Press - Materials Research Society
- Publish Date: 2005 - 2014
- Publish Location: Warrendale, Pa
“Materials, integration and technology for monolithic instruments” Subjects and Themes:
- Subjects: ➤ Metallic films - Metallizing - Semiconductors - Thin films - Design and construction - Materials - Congresses - Ultra large scale integration - Integrated circuits
Edition Identifiers:
- The Open Library ID: OL22729830M - OL34498267M
- Online Computer Library Center (OCLC) ID: 61254561
- Library of Congress Control Number (LCCN): 2005284657
- All ISBNs: 1107408954 - 1558998233 - 9781107408951 - 9781558998230
Access and General Info:
- First Year Published: 2005
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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18Handbook of multilevel metallization for integrated circuits
By Syd R. Wilson

“Handbook of multilevel metallization for integrated circuits” Metadata:
- Title: ➤ Handbook of multilevel metallization for integrated circuits
- Author: Syd R. Wilson
- Language: English
- Number of Pages: Median: 899
- Publisher: ➤ Elsevier Science & Technology Books - Noyes - William Andrew
- Publish Date: 1993
- Publish Location: Park Ridge, N.J., U.S.A
“Handbook of multilevel metallization for integrated circuits” Subjects and Themes:
- Subjects: ➤ Metallizing - Integrated circuits - Design and construction - Circuits intégrés - Conception et construction - Métallisation - TECHNOLOGY & ENGINEERING - Electronics - Circuits - Integrated - General - Circuitos integrados
Edition Identifiers:
- The Open Library ID: OL1417085M - OL34462738M
- Online Computer Library Center (OCLC) ID: 50306867 - 28422959
- Library of Congress Control Number (LCCN): 93026689
- All ISBNs: 9780815517610 - 0815517610 - 0815513402 - 9780815513407
Access and General Info:
- First Year Published: 1993
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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19Band-overlap metallization of BaS, BaSe, and BaTe
By A. E. Carlsson
“Band-overlap metallization of BaS, BaSe, and BaTe” Metadata:
- Title: ➤ Band-overlap metallization of BaS, BaSe, and BaTe
- Author: A. E. Carlsson
- Language: English
- Publisher: ➤ Laboratory of Atomic and Soild State Physics and the Materials Science Center, Cornell University - National Aeronautics and Space Administration
- Publish Date: 1984
- Publish Location: [Washington, D.C - Ithaca, N.Y
“Band-overlap metallization of BaS, BaSe, and BaTe” Subjects and Themes:
- Subjects: ➤ Bonding - Crystal lattices - Density distribution - Energy gaps (Solid state) - Metallizing - Semiconductors
Edition Identifiers:
- The Open Library ID: OL16154700M - OL18293315M
Access and General Info:
- First Year Published: 1984
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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20Stress-induced phenomena in metallization
By International Workshop on Stress-Induced Phenomena in Metallization (6th 2001 Ithaca, N.Y.)

“Stress-induced phenomena in metallization” Metadata:
- Title: ➤ Stress-induced phenomena in metallization
- Author: ➤ International Workshop on Stress-Induced Phenomena in Metallization (6th 2001 Ithaca, N.Y.)
- Language: English
- Number of Pages: Median: 250
- Publisher: American Institute of Physics
- Publish Date: 2002
- Publish Location: Melville, NY
“Stress-induced phenomena in metallization” Subjects and Themes:
- Subjects: ➤ Congresses - Defects - Thin film devices - Integrated circuits - Electrodiffusion - Semiconductors - Metallic films - Aluminum films - Metallizing
Edition Identifiers:
- The Open Library ID: OL10597377M - OL19289430M
- Online Computer Library Center (OCLC) ID: 49723827
- Library of Congress Control Number (LCCN): 2002102851
- All ISBNs: 073540058X - 9780735400580
Access and General Info:
- First Year Published: 2002
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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21Materials reliability in microelectronics VII

“Materials reliability in microelectronics VII” Metadata:
- Title: ➤ Materials reliability in microelectronics VII
- Language: English
- Number of Pages: Median: 457
- Publisher: Materials Research Society
- Publish Date: 1997 - 1999
- Publish Location: Pittsburgh, Pa
“Materials reliability in microelectronics VII” Subjects and Themes:
- Subjects: ➤ Reliability - Congresses - Microstructure - Materials - Metallizing - Testing - Microelectronics - Materials, research - Reliability (engineering)
Edition Identifiers:
- The Open Library ID: OL21264994M - OL12091914M
- Online Computer Library Center (OCLC) ID: 37954154
- All ISBNs: 1558993770 - 9781558993778
Access and General Info:
- First Year Published: 1997
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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22Silicon Solar Cell Metallization and Module Technology
By Thorsten Dullweber and Loic Tous
“Silicon Solar Cell Metallization and Module Technology” Metadata:
- Title: ➤ Silicon Solar Cell Metallization and Module Technology
- Authors: Thorsten DullweberLoic Tous
- Language: English
- Number of Pages: Median: 300
- Publisher: ➤ Institution of Engineering & Technology
- Publish Date: 2021
“Silicon Solar Cell Metallization and Module Technology” Subjects and Themes:
- Subjects: Engineering - Solar cells - Metallizing - Cellules solaires - Métallisation
Edition Identifiers:
- The Open Library ID: OL35564355M - OL33908431M
- Online Computer Library Center (OCLC) ID: 1285172283
- All ISBNs: 9781839531569 - 183953155X - 1839531568 - 9781839531552
Access and General Info:
- First Year Published: 2021
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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23Advanced metallization for future ULSI
By K. N. Tu

“Advanced metallization for future ULSI” Metadata:
- Title: ➤ Advanced metallization for future ULSI
- Author: K. N. Tu
- Language: English
- Number of Pages: Median: 597
- Publisher: Materials Research Society
- Publish Date: 1996
- Publish Location: Pittsburgh, Pa
“Advanced metallization for future ULSI” Subjects and Themes:
- Subjects: ➤ Congresses - Metallic films - Ultra large scale integration - Metallizing - Semiconductors - Integrated circuits - Design and construction - Metallography - Integrated circuits, very large scale integration
Edition Identifiers:
- The Open Library ID: OL989227M - OL8608947M
- Online Computer Library Center (OCLC) ID: 35174758
- Library of Congress Control Number (LCCN): 96027499
- All ISBNs: 1558993304 - 9781558993303
Access and General Info:
- First Year Published: 1996
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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24Advanced Metallization for Devices and Circuits - Science, Technology, and Manufacturability
By Shyam P. Murarka

“Advanced Metallization for Devices and Circuits - Science, Technology, and Manufacturability” Metadata:
- Title: ➤ Advanced Metallization for Devices and Circuits - Science, Technology, and Manufacturability
- Author: Shyam P. Murarka
- Language: English
- Number of Pages: Median: 768
- Publisher: Materials Research Society
- Publish Date: 1994
- Publish Location: Pittsburgh, Pa
“Advanced Metallization for Devices and Circuits - Science, Technology, and Manufacturability” Subjects and Themes:
- Subjects: Metallizing - Semiconductors - Congresses - Metallic films - Design and construction
Edition Identifiers:
- The Open Library ID: OL1081847M - OL8608876M
- Online Computer Library Center (OCLC) ID: 30739634
- Library of Congress Control Number (LCCN): 94005418
- All ISBNs: 9781558992375 - 1558992375
Access and General Info:
- First Year Published: 1994
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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25Melallization [i.e. Metallization] of polymers
By Steven P. Kowalczyk

“Melallization [i.e. Metallization] of polymers” Metadata:
- Title: ➤ Melallization [i.e. Metallization] of polymers
- Author: Steven P. Kowalczyk
- Language: English
- Number of Pages: Median: 529
- Publisher: ➤ American Chemical Society - An American Chemical Society Publication
- Publish Date: 1990 - 1998
- Publish Location: Washington, DC
“Melallization [i.e. Metallization] of polymers” Subjects and Themes:
- Subjects: ➤ Surfaces - Polymers - Metal coating - Metallizing - Diffusion coatings - Polymers, surfaces
Edition Identifiers:
- The Open Library ID: OL8226699M - OL1886347M
- Library of Congress Control Number (LCCN): 90047471
- All ISBNs: 0841218684 - 9780841218680
Access and General Info:
- First Year Published: 1990
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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26Metallization and Metal-Conductor Interfaces
By Inder P. Batra
“Metallization and Metal-Conductor Interfaces” Metadata:
- Title: ➤ Metallization and Metal-Conductor Interfaces
- Author: Inder P. Batra
- Language: English
- Number of Pages: Median: 522
- Publisher: Springer
- Publish Date: 1989
“Metallization and Metal-Conductor Interfaces” Subjects and Themes:
- Subjects: Semiconductor-metal boundaries - Congresses - Metallizing
Edition Identifiers:
- The Open Library ID: OL10324124M
- Online Computer Library Center (OCLC) ID: 19396418
- Library of Congress Control Number (LCCN): 89031077
- All ISBNs: 9780306431593 - 0306431599
Access and General Info:
- First Year Published: 1989
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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27Metallization of Polymers 2
By Edward Sacher

“Metallization of Polymers 2” Metadata:
- Title: Metallization of Polymers 2
- Author: Edward Sacher
- Language: English
- Number of Pages: Median: 216
- Publisher: Springer
- Publish Date: 2002
“Metallization of Polymers 2” Subjects and Themes:
- Subjects: ➤ Metal coating - Congresses - Polymers - Surfaces - Metallizing - Diffusion coatings - Polymers, surfaces
Edition Identifiers:
- The Open Library ID: OL9754607M
- Online Computer Library Center (OCLC) ID: 49285731
- Library of Congress Control Number (LCCN): 2002022134
- All ISBNs: 0306472538 - 9780306472534
First Setence:
"Recent developments in instrumentation and the availability of several high quality commercial Raman microscopes have made Raman micro-spectroscopy an emerging tool for surface analysis."
Access and General Info:
- First Year Published: 2002
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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28Metallizing terms and their definitions
By American Welding Society. Committee on Metallizing.
“Metallizing terms and their definitions” Metadata:
- Title: ➤ Metallizing terms and their definitions
- Author: ➤ American Welding Society. Committee on Metallizing.
- Language: English
- Publisher: American Welding Society
- Publish Date: 1962
- Publish Location: New York
“Metallizing terms and their definitions” Subjects and Themes:
- Subjects: Dictionaries - Metallizing
Edition Identifiers:
- The Open Library ID: OL5762210M
- Library of Congress Control Number (LCCN): 71210266
Access and General Info:
- First Year Published: 1962
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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29Proceedings of Advanced Metallization Conference 2004
By Darrell, et al (editors) Erb

“Proceedings of Advanced Metallization Conference 2004” Metadata:
- Title: ➤ Proceedings of Advanced Metallization Conference 2004
- Author: Darrell, et al (editors) Erb
- Number of Pages: Median: 875
- Publisher: Materials Research Society
- Publish Date: 2005
“Proceedings of Advanced Metallization Conference 2004” Subjects and Themes:
- Subjects: ➤ Semiconductors - Design and construction - Congresses - Integrated circuits - Ultra large scale integration - Materials - Thin films - Metallic films - Metallizing
Edition Identifiers:
- The Open Library ID: OL12092041M
- Online Computer Library Center (OCLC) ID: 57756790
- All ISBNs: 9781558998148 - 1558998144
Access and General Info:
- First Year Published: 2005
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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30Electromigration behavior of a multi-layer metallization
By Edgar Arthur Schönbächler
“Electromigration behavior of a multi-layer metallization” Metadata:
- Title: ➤ Electromigration behavior of a multi-layer metallization
- Author: Edgar Arthur Schönbächler
- Language: English
- Publish Date: 1998
“Electromigration behavior of a multi-layer metallization” Subjects and Themes:
- Subjects: ➤ Semiconductors - Design and construction - Thin films - Electric properties - Electrodiffusion - Microstructure - Metallizing
Edition Identifiers:
- The Open Library ID: OL50045811M
- Online Computer Library Center (OCLC) ID: 144552919
Access and General Info:
- First Year Published: 1998
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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31Metalization of large silicon wafers
By R. Pryor
“Metalization of large silicon wafers” Metadata:
- Title: ➤ Metalization of large silicon wafers
- Author: R. Pryor
- Language: English
- Number of Pages: Median: 43
- Publisher: ➤ U.S. Dept. of Energy, [Division of] Solar Energy - available from NTIS
- Publish Date: 1978
- Publish Location: ➤ Washington, D.C.] - Springfield, Va
“Metalization of large silicon wafers” Subjects and Themes:
- Subjects: Solar cells - Metallizing
Edition Identifiers:
- The Open Library ID: OL50293195M
- Online Computer Library Center (OCLC) ID: 27327576
Access and General Info:
- First Year Published: 1978
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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32Metallization of large silicon wafers
By R. Pryor
“Metallization of large silicon wafers” Metadata:
- Title: ➤ Metallization of large silicon wafers
- Author: R. Pryor
- Language: English
- Number of Pages: Median: 133
- Publisher: ➤ U.S. Dept. of Energy, [Division of] Solar Energy - available from NTIS
- Publish Date: 1979
- Publish Location: ➤ Washington, D.C.] - Springfield, Va
“Metallization of large silicon wafers” Subjects and Themes:
- Subjects: Solar cells - Metallizing
Edition Identifiers:
- The Open Library ID: OL50293196M
- Online Computer Library Center (OCLC) ID: 27059261
Access and General Info:
- First Year Published: 1979
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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33Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging
By Symposium on Electromigration of Metals (1984 New Orleans, La.)
“Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging” Metadata:
- Title: ➤ Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging
- Author: ➤ Symposium on Electromigration of Metals (1984 New Orleans, La.)
- Language: English
- Number of Pages: Median: 201
- Publisher: Electrochemical Society
- Publish Date: 1985
- Publish Location: Pennington, NJ
“Proceedings of the Symposium on Electromigration of Metals and First International Symposium on Multilevel Metallization and Packaging” Subjects and Themes:
- Subjects: Congresses - Electrodiffusion - Metallizing - Vapor-plating
Edition Identifiers:
- The Open Library ID: OL2559449M
- Online Computer Library Center (OCLC) ID: 12406459
- Library of Congress Control Number (LCCN): 85080217
Access and General Info:
- First Year Published: 1985
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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34Low-rank coals and waste materials for reduction roasting and metallization of iron oxides
By Peterson, R. E.
“Low-rank coals and waste materials for reduction roasting and metallization of iron oxides” Metadata:
- Title: ➤ Low-rank coals and waste materials for reduction roasting and metallization of iron oxides
- Author: Peterson, R. E.
- Language: English
- Number of Pages: Median: 17
- Publisher: ➤ U.S. Dept. of the Interior, Bureau of Mines
- Publish Date: 1983
- Publish Location: [Washington, D.C.]
“Low-rank coals and waste materials for reduction roasting and metallization of iron oxides” Subjects and Themes:
- Subjects: ➤ Coal - Deoxidizing of metals - Iron - Iron oxides - Metallizing - Metallurgy - Waste products
Edition Identifiers:
- The Open Library ID: OL3140130M
- Library of Congress Control Number (LCCN): 82600332
Access and General Info:
- First Year Published: 1983
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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35Advanced Metallization Conference 2003 (AMC 2003)
By Advanced Metallization Conference (2003 Montreal, Canada and Tokyo, Japan)
“Advanced Metallization Conference 2003 (AMC 2003)” Metadata:
- Title: ➤ Advanced Metallization Conference 2003 (AMC 2003)
- Author: ➤ Advanced Metallization Conference (2003 Montreal, Canada and Tokyo, Japan)
- Language: English
- Number of Pages: Median: 792
- Publisher: Materials Research Society
- Publish Date: 2004
- Publish Location: Warrendale, Pa
“Advanced Metallization Conference 2003 (AMC 2003)” Subjects and Themes:
- Subjects: ➤ Semiconductors - Design and construction - Congresses - Integrated circuits - Ultra large scale integration - Materials - Thin films - Metallic films - Metallizing
Edition Identifiers:
- The Open Library ID: OL57288191M
- Online Computer Library Center (OCLC) ID: 55655702
Access and General Info:
- First Year Published: 2004
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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36A mechanistic study of a degenerate intramolecular alkali metallation reaction
By Öjvind Davidsson
“A mechanistic study of a degenerate intramolecular alkali metallation reaction” Metadata:
- Title: ➤ A mechanistic study of a degenerate intramolecular alkali metallation reaction
- Author: Öjvind Davidsson
- Language: English
- Number of Pages: Median: 98
- Publisher: ➤ Dept. of Organic Chemistry, Chalmers University of Technology and University of Göteborg
- Publish Date: 1990
- Publish Location: Göteborg, Sweden
“A mechanistic study of a degenerate intramolecular alkali metallation reaction” Subjects and Themes:
- Subjects: Carbanions - Reactivity - Metallizing - Alkali metals
Edition Identifiers:
- The Open Library ID: OL57203904M
- Online Computer Library Center (OCLC) ID: 28301796
- All ISBNs: 9170325138 - 9789170325137
Access and General Info:
- First Year Published: 1990
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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37Proceedings of the Thirteenth State-of-the Art Program on Compound Semiconductors (SOTAPOCS XIII) and the Symposium on Metallization of III-V Compound Semiconductors
By State-of-the-Art Program on Compound Semiconductors (13th 1990 Seattle, Wash.)
“Proceedings of the Thirteenth State-of-the Art Program on Compound Semiconductors (SOTAPOCS XIII) and the Symposium on Metallization of III-V Compound Semiconductors” Metadata:
- Title: ➤ Proceedings of the Thirteenth State-of-the Art Program on Compound Semiconductors (SOTAPOCS XIII) and the Symposium on Metallization of III-V Compound Semiconductors
- Author: ➤ State-of-the-Art Program on Compound Semiconductors (13th 1990 Seattle, Wash.)
- Language: English
- Number of Pages: Median: 365
- Publisher: Electrochemical Society
- Publish Date: 1991
- Publish Location: ➤ Pennington, NJ (10 S. Main St., Pennington 08534-2896)
“Proceedings of the Thirteenth State-of-the Art Program on Compound Semiconductors (SOTAPOCS XIII) and the Symposium on Metallization of III-V Compound Semiconductors” Subjects and Themes:
- Subjects: ➤ Compound semiconductors - Congresses - Ion implantation - Metallizing - Molecular beam epitaxy - Superlattices as materials
Edition Identifiers:
- The Open Library ID: OL1899225M
- Online Computer Library Center (OCLC) ID: 24009310
- Library of Congress Control Number (LCCN): 90086400
Access and General Info:
- First Year Published: 1991
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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38Metallization and metal-semiconductor interfaces
By NATO Advanced Research Workshop on Metallization and Metal-Semiconductor Interfaces (1988 Technical University of Munich)
“Metallization and metal-semiconductor interfaces” Metadata:
- Title: ➤ Metallization and metal-semiconductor interfaces
- Author: ➤ NATO Advanced Research Workshop on Metallization and Metal-Semiconductor Interfaces (1988 Technical University of Munich)
- Language: English
- Number of Pages: Median: 510
- Publisher: Plenum Press
- Publish Date: 1989
- Publish Location: New York
“Metallization and metal-semiconductor interfaces” Subjects and Themes:
- Subjects: Congresses - Metallizing - Semiconductor-metal boundaries
Edition Identifiers:
- The Open Library ID: OL2208741M
- Library of Congress Control Number (LCCN): 89031077
- All ISBNs: 9780306431593 - 0306431599
Access and General Info:
- First Year Published: 1989
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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39Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies
By Symposium on Multilevel Metallization, Interconnection, and Contact Technologies (1986 : San Diego, Calif.)
“Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies” Metadata:
- Title: ➤ Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies
- Author: ➤ Symposium on Multilevel Metallization, Interconnection, and Contact Technologies (1986 : San Diego, Calif.)
- Language: English
- Number of Pages: Median: 272
- Publisher: Electrochemical Society, Inc.
- Publish Date: 1987
- Publish Location: ➤ Pennington, NJ (10 S. Main St., Pennington 08534-2896)
“Proceedings of the Symposium on Multilevel Metallization, Interconnection, and Contact Technologies” Subjects and Themes:
- Subjects: Congresses - Design and construction - Integrated circuits - Metallizing - Very large scale integration
Edition Identifiers:
- The Open Library ID: OL2415117M
- Online Computer Library Center (OCLC) ID: 16930060
- Library of Congress Control Number (LCCN): 87080539
Access and General Info:
- First Year Published: 1987
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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40Proceedings of the symposia on reliability of semiconductor devices and interconnection and multilevel metallization, interconnection, and contact technologies
“Proceedings of the symposia on reliability of semiconductor devices and interconnection and multilevel metallization, interconnection, and contact technologies” Metadata:
- Title: ➤ Proceedings of the symposia on reliability of semiconductor devices and interconnection and multilevel metallization, interconnection, and contact technologies
- Language: English
- Number of Pages: Median: 495
- Publisher: Electrochemical Society
- Publish Date: 1989
- Publish Location: ➤ Pennington, NJ (10 S. Main St., Pennington 08534-2896)
“Proceedings of the symposia on reliability of semiconductor devices and interconnection and multilevel metallization, interconnection, and contact technologies” Subjects and Themes:
- Subjects: ➤ Reliability - Congresses - Metallizing - Very large scale integration - Semiconductors - Integrated circuits - Design and construction
Edition Identifiers:
- The Open Library ID: OL2230175M
- Online Computer Library Center (OCLC) ID: 20357147
- Library of Congress Control Number (LCCN): 89083803
Access and General Info:
- First Year Published: 1989
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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41Process, equipment, and materials control in integrated circuit manufacturing II
“Process, equipment, and materials control in integrated circuit manufacturing II” Metadata:
- Title: ➤ Process, equipment, and materials control in integrated circuit manufacturing II
- Language: English
- Number of Pages: Median: 258
- Publisher: SPIE
- Publish Date: 1996
- Publish Location: Bellingham, Wash., USA
“Process, equipment, and materials control in integrated circuit manufacturing II” Subjects and Themes:
- Subjects: ➤ Congresses - Plasma etching - Dielectric films - Metallizing - Integrated circuits - Design and construction
Edition Identifiers:
- The Open Library ID: OL1016234M
- Online Computer Library Center (OCLC) ID: 35664549
- Library of Congress Control Number (LCCN): 96069471
- All ISBNs: 9780819422743 - 0819422746
Access and General Info:
- First Year Published: 1996
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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42Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials

“Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials” Metadata:
- Title: ➤ Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials
- Language: English
- Number of Pages: Median: 494
- Publisher: Electrochemical Society
- Publish Date: 1993
- Publish Location: Pennington, NJ
“Proceedings of the symposia on interconnects, contact metallization, and multilevel metallization and reliability for semiconductor devices, interconnects, and thin insulator materials” Subjects and Themes:
- Subjects: ➤ Metallizing - Semiconductors - Congresses - Electronic packaging - Reliability - Integrated circuits - Very large scale integration - Design and construction
Edition Identifiers:
- The Open Library ID: OL1439289M
- Online Computer Library Center (OCLC) ID: 30385761
- Library of Congress Control Number (LCCN): 93070069
- All ISBNs: 156677067X - 9781566770675
Access and General Info:
- First Year Published: 1993
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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43Multilevel interconnect technology III
“Multilevel interconnect technology III” Metadata:
- Title: ➤ Multilevel interconnect technology III
- Language: English
- Number of Pages: Median: 184
- Publisher: SPIE
- Publish Date: 1999
- Publish Location: Bellingham, Wash., USA
“Multilevel interconnect technology III” Subjects and Themes:
- Subjects: ➤ Dielectric films - Congresses - Plasma etching - Very large scale integration - Metallizing - Integrated circuits - Design and construction - Optics
Edition Identifiers:
- The Open Library ID: OL6803715M
- Online Computer Library Center (OCLC) ID: 42777200
- Library of Congress Control Number (LCCN): 00266007
- All ISBNs: 9780819434807 - 0819434809
Access and General Info:
- First Year Published: 1999
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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44Process, equipment, and materials control in integrated circuit manufacturing V
“Process, equipment, and materials control in integrated circuit manufacturing V” Metadata:
- Title: ➤ Process, equipment, and materials control in integrated circuit manufacturing V
- Language: English
- Number of Pages: Median: 310
- Publisher: SPIE
- Publish Date: 1999
- Publish Location: Bellingham, Wash., USA
“Process, equipment, and materials control in integrated circuit manufacturing V” Subjects and Themes:
- Subjects: ➤ Dielectric films - Congresses - Plasma etching - Process control - Metallizing - Integrated circuits - Design and construction
Edition Identifiers:
- The Open Library ID: OL6900387M
- Online Computer Library Center (OCLC) ID: 42779272
- Library of Congress Control Number (LCCN): 00710613
- All ISBNs: 0819434795 - 9780819434791
Access and General Info:
- First Year Published: 1999
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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45Submicrometer metallization
By Krishna Shenai

“Submicrometer metallization” Metadata:
- Title: Submicrometer metallization
- Author: Krishna Shenai
- Language: English
- Number of Pages: Median: 344
- Publisher: SPIE
- Publish Date: 1993
- Publish Location: Bellingham, Wash
“Submicrometer metallization” Subjects and Themes:
- Subjects: ➤ Congresses - Metallic films - Semiconductor-metal boundaries - Metallizing - Electrodiffusion - Integrated circuits - Design and construction
Edition Identifiers:
- The Open Library ID: OL1747814M
- Online Computer Library Center (OCLC) ID: 28271722
- Library of Congress Control Number (LCCN): 92062654
- All ISBNs: 0819410039 - 9780819410030
Access and General Info:
- First Year Published: 1993
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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46Analysis of LDEF experiment AO187-2 chemical and isotopic measurements of micrometeoroids by secondary ion mass spectrometry
By Ernst Zinner
“Analysis of LDEF experiment AO187-2 chemical and isotopic measurements of micrometeoroids by secondary ion mass spectrometry” Metadata:
- Title: ➤ Analysis of LDEF experiment AO187-2 chemical and isotopic measurements of micrometeoroids by secondary ion mass spectrometry
- Author: Ernst Zinner
- Language: English
- Publisher: ➤ The Administration - National Technical Information Service, distributor
- Publish Date: 1995
- Publish Location: ➤ [Washington, D.C - Springfield, Va
“Analysis of LDEF experiment AO187-2 chemical and isotopic measurements of micrometeoroids by secondary ion mass spectrometry” Subjects and Themes:
- Subjects: ➤ Foils (Materials) - Interplanetary dust - Metallizing - Long Duration Exposure Facility - Impingement - Secondary ion mass spectrometry - Isotopic labeling - Hypervelocity impact - Micrometeoroids - Space debris - Chemical analysis
Edition Identifiers:
- The Open Library ID: OL15420663M
Access and General Info:
- First Year Published: 1995
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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47Quarterly technical progress report no. 6329-24 on the development of metallization process
By Alexander Garcia
“Quarterly technical progress report no. 6329-24 on the development of metallization process” Metadata:
- Title: ➤ Quarterly technical progress report no. 6329-24 on the development of metallization process
- Author: Alexander Garcia
- Language: English
- Publisher: ➤ Jet Propulsion Laboratory, California Institute of Technology - Spectrolab, Inc.
- Publish Date: 1984
- Publish Location: ➤ [Pasadena, Calif - Sylmar, Calif
“Quarterly technical progress report no. 6329-24 on the development of metallization process” Subjects and Themes:
- Subjects: ➤ Additives - Electron microscopy - Flat-plate Solar Array Project - Metallizing - Microstructure - Paste (consistency) - Solar cells - Testing
Edition Identifiers:
- The Open Library ID: OL16154805M
Access and General Info:
- First Year Published: 1984
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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48Advanced Metallization Conference 1999 (AMC 1999)
By Advanced Metallization Conference (1999 Orlando, Fla.)

“Advanced Metallization Conference 1999 (AMC 1999)” Metadata:
- Title: ➤ Advanced Metallization Conference 1999 (AMC 1999)
- Author: ➤ Advanced Metallization Conference (1999 Orlando, Fla.)
- Language: English
- Number of Pages: Median: 763
- Publisher: Materials Research Society
- Publish Date: 2000
- Publish Location: Warrendale, Pa
“Advanced Metallization Conference 1999 (AMC 1999)” Subjects and Themes:
- Subjects: Congresses - Metallizing - Electronic circuit design - Dielectrics - Design and construction
Edition Identifiers:
- The Open Library ID: OL19019956M
- Online Computer Library Center (OCLC) ID: 45251426
- All ISBNs: 9781558995390 - 1558995390
Access and General Info:
- First Year Published: 2000
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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49Advanced Metallization Conference 2005 (AMC 2005)
By Advanced Metallization Conference (2005 Colorado Springs, Colo. and Tokyo, Japan)

“Advanced Metallization Conference 2005 (AMC 2005)” Metadata:
- Title: ➤ Advanced Metallization Conference 2005 (AMC 2005)
- Author: ➤ Advanced Metallization Conference (2005 Colorado Springs, Colo. and Tokyo, Japan)
- Language: English
- Number of Pages: Median: 775
- Publisher: Materials Research Society
- Publish Date: 2006
- Publish Location: Warrendale, Pa
“Advanced Metallization Conference 2005 (AMC 2005)” Subjects and Themes:
- Subjects: ➤ Congresses - Design and construction - Ultra large scale integration - Integrated circuits - Metallic films - Metallizing - Semiconductors - Thin films - Materials - Integrated circuits, ultra large scale integration
Edition Identifiers:
- The Open Library ID: OL18276395M
- Online Computer Library Center (OCLC) ID: 64279772
- All ISBNs: 1558998659 - 9781558998650
Access and General Info:
- First Year Published: 2006
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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50Electromigration behavior of a multi-layer metallization (Series in microelectronics)
By Edgar Arthur Schonbachler
“Electromigration behavior of a multi-layer metallization (Series in microelectronics)” Metadata:
- Title: ➤ Electromigration behavior of a multi-layer metallization (Series in microelectronics)
- Author: Edgar Arthur Schonbachler
- Language: English
- Number of Pages: Median: 137
- Publisher: Hartung-Gorre
- Publish Date: 1998
“Electromigration behavior of a multi-layer metallization (Series in microelectronics)” Subjects and Themes:
- Subjects: ➤ Microstructure - Electric properties - Metallizing - Semiconductors - Electrodiffusion - Thin films - Design and construction
Edition Identifiers:
- The Open Library ID: OL12985286M
- Online Computer Library Center (OCLC) ID: 41137409
- Library of Congress Control Number (LCCN): 98212553
- All ISBNs: 389649306X - 9783896493064
Access and General Info:
- First Year Published: 1998
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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