Process, equipment, and materials control in integrated circuit manufacturing III - Info and Reading Options
1-2 October 1997, Austin, Texas
"Process, equipment, and materials control in integrated circuit manufacturing III" was published by SPIE in 1997 - Bellingham, Washington, it has 270 pages and the language of the book is English.
“Process, equipment, and materials control in integrated circuit manufacturing III” Metadata:
- Title: ➤ Process, equipment, and materials control in integrated circuit manufacturing III
- Language: English
- Number of Pages: 270
- Publisher: SPIE
- Publish Date: 1997
- Publish Location: Bellingham, Washington
- Dewey Decimal Classification: 621.3815
- Library of Congress Classification: TK7874 .P7519 1997TK7874.P7519 1997
“Process, equipment, and materials control in integrated circuit manufacturing III” Subjects and Themes:
- Subjects: ➤ Congresses - Plasma etching - Dielectric films - Metallizing - Integrated circuits - Design and construction
Edition Specifications:
- Pagination: ix, 270 p. :
Edition Identifiers:
- The Open Library ID: OL418375M - OL23675015W
- Online Computer Library Center (OCLC) ID: 37743222 - 37731294
- Library of Congress Control Number (LCCN): 98122092
- ISBN-10: 0819426458
- All ISBNs: 0819426458
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