Process, equipment, and materials control in integrated circuit manufacturing II - Info and Reading Options
16-17 October 1996, Austin, Texas
"Process, equipment, and materials control in integrated circuit manufacturing II" was published by SPIE in 1996 - Bellingham, Wash., USA, it has 258 pages and the language of the book is English.
“Process, equipment, and materials control in integrated circuit manufacturing II” Metadata:
- Title: ➤ Process, equipment, and materials control in integrated circuit manufacturing II
- Language: English
- Number of Pages: 258
- Publisher: SPIE
- Publish Date: 1996
- Publish Location: Bellingham, Wash., USA
- Library of Congress Classification: TK7874 .P7519 1996
“Process, equipment, and materials control in integrated circuit manufacturing II” Subjects and Themes:
- Subjects: ➤ Congresses - Plasma etching - Dielectric films - Metallizing - Integrated circuits - Design and construction
Edition Specifications:
- Pagination: vii, 258 p. :
Edition Identifiers:
- The Open Library ID: OL1016234M - OL23613343W
- Online Computer Library Center (OCLC) ID: 35664549
- Library of Congress Control Number (LCCN): 96069471
- ISBN-10: 0819422746
- All ISBNs: 0819422746
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