Explore: Electronic Engineering (specific Aspects)

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Source: The Open Library

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1Electronic materials and processes

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Book's cover

“Electronic materials and processes” Metadata:

  • Title: ➤  Electronic materials and processes
  • Authors: ➤  
  • Language: English
  • Publisher: ➤  Society for Advancement of - Society for the Advancement of Material and Process Engineering - SAMPE
  • Publish Date:
  • Publish Location: Covina, Calif

“Electronic materials and processes” Subjects and Themes:

Edition Identifiers:

Access and General Info:

  • First Year Published: 1987
  • Is Full Text Available: Yes
  • Is The Book Public: No
  • Access Status: Borrowable

Online Access

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2Advanced metallizations in microelectronics

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Book's cover

“Advanced metallizations in microelectronics” Metadata:

  • Title: ➤  Advanced metallizations in microelectronics
  • Authors:
  • Language: English
  • Number of Pages: Median: 633
  • Publisher: ➤  Materials Research Society - University of Cambridge ESOL Examinations
  • Publish Date:
  • Publish Location: Pittsburgh, Pa

“Advanced metallizations in microelectronics” Subjects and Themes:

Edition Identifiers:

Access and General Info:

  • First Year Published: 1990
  • Is Full Text Available: Yes
  • Is The Book Public: No
  • Access Status: Borrowable

Online Access

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3Applied electronic instrumentation and measurement

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Book's cover

“Applied electronic instrumentation and measurement” Metadata:

  • Title: ➤  Applied electronic instrumentation and measurement
  • Authors:
  • Language: English
  • Number of Pages: Median: 830
  • Publisher: ➤  Maxwell Macmillan - Collier Macmillan Canada - Maxwell Macmillan International Pub. Group - Prentice Hall - Merrill - Prentice-Hall
  • Publish Date:
  • Publish Location: ➤  Englewood Cliffs, N. J - New York - Toronto - Oxford

“Applied electronic instrumentation and measurement” Subjects and Themes:

Edition Identifiers:

Access and General Info:

  • First Year Published: 1992
  • Is Full Text Available: No
  • Is The Book Public: No
  • Access Status: No_ebook

Online Access

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    4Electronic packaging materials science III

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    Book's cover

    “Electronic packaging materials science III” Metadata:

    • Title: ➤  Electronic packaging materials science III
    • Authors:
    • Language: English
    • Number of Pages: Median: 479
    • Publisher: Materials Research Society
    • Publish Date:
    • Publish Location: Pittsburgh, Pa

    “Electronic packaging materials science III” Subjects and Themes:

    Edition Identifiers:

    Access and General Info:

    • First Year Published: 1988
    • Is Full Text Available: No
    • Is The Book Public: No
    • Access Status: No_ebook

    Online Access

    Downloads Are Not Available:

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      5A twentieth century professional institution

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      Book's cover

      “A twentieth century professional institution” Metadata:

      • Title: ➤  A twentieth century professional institution
      • Authors:
      • Language: English
      • Number of Pages: Median: 332
      • Publisher: ➤  Peter Peregrinus on behalf of the Institution of Electrical Engineers - Institution of Electrical Engineers
      • Publish Date:
      • Publish Location: London, U.K

      “A twentieth century professional institution” Subjects and Themes:

      Edition Identifiers:

      Access and General Info:

      • First Year Published: 1989
      • Is Full Text Available: No
      • Is The Book Public: No
      • Access Status: No_ebook

      Online Access

      Downloads Are Not Available:

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        6Sotsʻialakan kʻaghakʻakanutʻyan genderatsʻumě

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        “Sotsʻialakan kʻaghakʻakanutʻyan genderatsʻumě” Metadata:

        • Title: ➤  Sotsʻialakan kʻaghakʻakanutʻyan genderatsʻumě
        • Authors:
        • Language: arm
        • Number of Pages: Median: 300
        • Publisher: ➤  IEEE - "Dall" hratarakchʻutʻyun
        • Publish Date:
        • Publish Location: Erevan

        “Sotsʻialakan kʻaghakʻakanutʻyan genderatsʻumě” Subjects and Themes:

        Edition Identifiers:

        Access and General Info:

        • First Year Published: 1983
        • Is Full Text Available: No
        • Is The Book Public: No
        • Access Status: No_ebook

        Online Access

        Downloads Are Not Available:

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          7Multichip modules

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          Book's cover

          “Multichip modules” Metadata:

          • Title: Multichip modules
          • Authors:
          • Language: English
          • Number of Pages: Median: 630
          • Publisher: ➤  IEEE Press - Brand: Ieee - Ieee - IEEE
          • Publish Date:
          • Publish Location: New York

          “Multichip modules” Subjects and Themes:

          Edition Identifiers:

          Access and General Info:

          • First Year Published: 1991
          • Is Full Text Available: No
          • Is The Book Public: No
          • Access Status: No_ebook

          Online Access

          Downloads Are Not Available:

          The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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