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Source: The Open Library

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Search results from The Open Library

1Encyclopedia of Thermal Packaging

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“Encyclopedia of Thermal Packaging” Metadata:

  • Title: ➤  Encyclopedia of Thermal Packaging
  • Author:
  • Language: English
  • Number of Pages: Median: 1375
  • Publisher: ➤  World Scientific Publishing Co Pte Ltd
  • Publish Date:

“Encyclopedia of Thermal Packaging” Subjects and Themes:

Edition Identifiers:

Access and General Info:

  • First Year Published: 2012
  • Is Full Text Available: No
  • Is The Book Public: No
  • Access Status: No_ebook

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2Practical Guide to the Packaging of Electronics

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Book's cover

“Practical Guide to the Packaging of Electronics” Metadata:

  • Title: ➤  Practical Guide to the Packaging of Electronics
  • Author:
  • Language: English
  • Number of Pages: Median: 342
  • Publisher: ➤  CRC Press - Taylor & Francis Group - CRC
  • Publish Date: ➤  

“Practical Guide to the Packaging of Electronics” Subjects and Themes:

Edition Identifiers:

First Setence:

"Let us assume that you have the responsibility of developing a new electronics system."

Access and General Info:

  • First Year Published: 2002
  • Is Full Text Available: Yes
  • Is The Book Public: No
  • Access Status: Printdisabled

Online Access

Downloads Are Not Available:

The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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    3Embedded Systems Design with 8051 Microcontrollers

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    Book's cover

    “Embedded Systems Design with 8051 Microcontrollers” Metadata:

    • Title: ➤  Embedded Systems Design with 8051 Microcontrollers
    • Author:
    • Language: English
    • Number of Pages: Median: 432
    • Publisher: Taylor & Francis Group - CRC
    • Publish Date:

    “Embedded Systems Design with 8051 Microcontrollers” Subjects and Themes:

    Edition Identifiers:

    First Setence:

    "The full understanding of microcontrollers and their applications demands knowledge of all aspects of digital systems, from logic gates to microcomputers."

    Access and General Info:

    • First Year Published: 1999
    • Is Full Text Available: No
    • Is The Book Public: No
    • Access Status: No_ebook

    Online Access

    Downloads Are Not Available:

    The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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      4Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

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      Book's cover

      “Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging” Metadata:

      • Title: ➤  Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
      • Author:
      • Language: English
      • Number of Pages: Median: 322
      • Publisher: ➤  Taylor & Francis Group - CRC Press
      • Publish Date:

      “Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging” Subjects and Themes:

      Edition Identifiers:

      Access and General Info:

      • First Year Published: 2017
      • Is Full Text Available: No
      • Is The Book Public: No
      • Access Status: No_ebook

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      5Handbook of electronic package design

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      Book's cover

      “Handbook of electronic package design” Metadata:

      • Title: ➤  Handbook of electronic package design
      • Author:
      • Language: English
      • Number of Pages: Median: 904
      • Publisher: ➤  Marcel Dekker - Taylor & Francis Group
      • Publish Date:
      • Publish Location: New York

      “Handbook of electronic package design” Subjects and Themes:

      Edition Identifiers:

      Access and General Info:

      • First Year Published: 1991
      • Is Full Text Available: No
      • Is The Book Public: No
      • Access Status: No_ebook

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      6The Electronic Packaging Handbook

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      Book's cover

      “The Electronic Packaging Handbook” Metadata:

      • Title: ➤  The Electronic Packaging Handbook
      • Author:
      • Language: English
      • Number of Pages: Median: 640
      • Publisher: ➤  CRC Press in cooperation with IEEE Press - Taylor & Francis Group - CRC
      • Publish Date:
      • Publish Location: Boca Raton, Fla

      “The Electronic Packaging Handbook” Subjects and Themes:

      Edition Identifiers:

      First Setence:

      "This handbook is written for the practicing engineer who needs current information on electronic packaging at the circuit level."

      Access and General Info:

      • First Year Published: 1999
      • Is Full Text Available: No
      • Is The Book Public: No
      • Access Status: Unclassified

      Online Access

      Downloads Are Not Available:

      The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

      Online Borrowing:

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        7Thermal design of electronic equipment

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        Book's cover

        “Thermal design of electronic equipment” Metadata:

        • Title: ➤  Thermal design of electronic equipment
        • Author:
        • Language: English
        • Number of Pages: Median: 400
        • Publisher: ➤  CRC Press - Taylor & Francis Group
        • Publish Date:
        • Publish Location: Boca Raton, Fla

        “Thermal design of electronic equipment” Subjects and Themes:

        Edition Identifiers:

        Access and General Info:

        • First Year Published: 2001
        • Is Full Text Available: Yes
        • Is The Book Public: No
        • Access Status: Printdisabled

        Online Access

        Downloads Are Not Available:

        The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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          8Heat transfer

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          “Heat transfer” Metadata:

          • Title: Heat transfer
          • Author:
          • Language: English
          • Number of Pages: Median: 523
          • Publisher: ➤  Taylor & Francis Group - Taylor & Francis
          • Publish Date:
          • Publish Location: Boca Raton

          “Heat transfer” Subjects and Themes:

          Edition Identifiers:

          Access and General Info:

          • First Year Published: 2009
          • Is Full Text Available: No
          • Is The Book Public: No
          • Access Status: No_ebook

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          9Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

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          “Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments” Metadata:

          • Title: ➤  Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
          • Authors:
          • Language: English
          • Number of Pages: Median: 256
          • Publisher: ➤  Taylor & Francis Group - CRC Press LLC
          • Publish Date:

          “Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments” Subjects and Themes:

          Edition Identifiers:

          Access and General Info:

          • First Year Published: 2021
          • Is Full Text Available: No
          • Is The Book Public: No
          • Access Status: No_ebook

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          10Hermeticity of electronic packages

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          Book's cover

          “Hermeticity of electronic packages” Metadata:

          • Title: ➤  Hermeticity of electronic packages
          • Author:
          • Language: English
          • Number of Pages: Median: 414
          • Publisher: ➤  Noyes Publications - William Andrew Pub. - Elsevier Science & Technology Books
          • Publish Date:
          • Publish Location: Norwich, N.Y - Park Ridge, N.J

          “Hermeticity of electronic packages” Subjects and Themes:

          Edition Identifiers:

          Access and General Info:

          • First Year Published: 1999
          • Is Full Text Available: Yes
          • Is The Book Public: No
          • Access Status: Printdisabled

          Online Access

          Downloads Are Not Available:

          The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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            11Energy Storage Systems in Electronics

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            Book's cover

            “Energy Storage Systems in Electronics” Metadata:

            • Title: ➤  Energy Storage Systems in Electronics
            • Authors:
            • Language: English
            • Number of Pages: Median: 604
            • Publisher: ➤  Gordon and Breach Science Publishers - Taylor & Francis Group
            • Publish Date:
            • Publish Location: Amsterdam

            “Energy Storage Systems in Electronics” Subjects and Themes:

            Edition Identifiers:

            Access and General Info:

            • First Year Published: 2000
            • Is Full Text Available: Yes
            • Is The Book Public: No
            • Access Status: Printdisabled

            Online Access

            Downloads Are Not Available:

            The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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              12Practical guide to the packaging of electronics

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              Book's cover

              “Practical guide to the packaging of electronics” Metadata:

              • Title: ➤  Practical guide to the packaging of electronics
              • Author:
              • Language: English
              • Number of Pages: Median: 202
              • Publisher: ➤  Marcel Dekker - CRC Press - Marcel Dekker, Inc.
              • Publish Date:
              • Publish Location: New York - Boca Raton, FL

              “Practical guide to the packaging of electronics” Subjects and Themes:

              Edition Identifiers:

              Access and General Info:

              • First Year Published: 2003
              • Is Full Text Available: No
              • Is The Book Public: No
              • Access Status: Unclassified

              Online Access

              Downloads Are Not Available:

              The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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                13RF and Microwave Module Level Design and Integration

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                Book's cover

                “RF and Microwave Module Level Design and Integration” Metadata:

                • Title: ➤  RF and Microwave Module Level Design and Integration
                • Author:
                • Language: English
                • Number of Pages: Median: 336
                • Publisher: ➤  Institution of Engineering & Technology
                • Publish Date:

                “RF and Microwave Module Level Design and Integration” Subjects and Themes:

                Edition Identifiers:

                Access and General Info:

                • First Year Published: 2019
                • Is Full Text Available: No
                • Is The Book Public: No
                • Access Status: No_ebook

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                14Ceramic interconnect technology handbook

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                Book's cover

                “Ceramic interconnect technology handbook” Metadata:

                • Title: ➤  Ceramic interconnect technology handbook
                • Author:
                • Language: English
                • Number of Pages: Median: 449
                • Publisher: ➤  CRC - CRC Press/Taylor & Francis
                • Publish Date:
                • Publish Location: Boca Raton, FL

                “Ceramic interconnect technology handbook” Subjects and Themes:

                Edition Identifiers:

                Access and General Info:

                • First Year Published: 2007
                • Is Full Text Available: No
                • Is The Book Public: No
                • Access Status: No_ebook

                Online Access

                Downloads Are Not Available:

                The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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                  15Electronic Scanned Array Design

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                  “Electronic Scanned Array Design” Metadata:

                  • Title: ➤  Electronic Scanned Array Design
                  • Author:
                  • Language: English
                  • Publisher: ➤  Institution of Engineering & Technology - SciTech Publishing, Incorporated
                  • Publish Date:

                  “Electronic Scanned Array Design” Subjects and Themes:

                  Edition Identifiers:

                  Access and General Info:

                  • First Year Published: 2021
                  • Is Full Text Available: No
                  • Is The Book Public: No
                  • Access Status: No_ebook

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                  16Lead-Free Soldering in Electronics

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                  Book's cover

                  “Lead-Free Soldering in Electronics” Metadata:

                  • Title: ➤  Lead-Free Soldering in Electronics
                  • Author:
                  • Language: English
                  • Number of Pages: Median: 376
                  • Publisher: CRC - Marcel Dekker, Inc.
                  • Publish Date:
                  • Publish Location: New York

                  “Lead-Free Soldering in Electronics” Subjects and Themes:

                  Edition Identifiers:

                  First Setence:

                  "Environmentally friendly technologies found within the industries at the forefront of the age of electronics and automobiles are destined to become one of the key facets of technology for the new era."

                  Access and General Info:

                  • First Year Published: 2003
                  • Is Full Text Available: No
                  • Is The Book Public: No
                  • Access Status: No_ebook

                  Online Access

                  Downloads Are Not Available:

                  The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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                    17Handbook of polymer coatings for electronics

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                    Book's cover

                    “Handbook of polymer coatings for electronics” Metadata:

                    • Title: ➤  Handbook of polymer coatings for electronics
                    • Author:
                    • Language: English
                    • Number of Pages: Median: 392
                    • Publisher: Noyes Publications
                    • Publish Date:
                    • Publish Location: Park Ridge, N.J., U.S.A

                    “Handbook of polymer coatings for electronics” Subjects and Themes:

                    Edition Identifiers:

                    Access and General Info:

                    • First Year Published: 1990
                    • Is Full Text Available: No
                    • Is The Book Public: No
                    • Access Status: No_ebook

                    Online Marketplaces

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                    18Mechanical analysis of electronic pakaging systems

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                    “Mechanical analysis of electronic pakaging systems” Metadata:

                    • Title: ➤  Mechanical analysis of electronic pakaging systems
                    • Author:
                    • Language: English
                    • Number of Pages: Median: 355
                    • Publisher: Marcel Dekker
                    • Publish Date:
                    • Publish Location: New York

                    “Mechanical analysis of electronic pakaging systems” Subjects and Themes:

                    Edition Identifiers:

                    Access and General Info:

                    • First Year Published: 1999
                    • Is Full Text Available: No
                    • Is The Book Public: No
                    • Access Status: No_ebook

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                    19Integrated packaging systems for transportation and distribution

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                    Book's cover

                    “Integrated packaging systems for transportation and distribution” Metadata:

                    • Title: ➤  Integrated packaging systems for transportation and distribution
                    • Author:
                    • Language: English
                    • Number of Pages: Median: 269
                    • Publisher: M. Dekker
                    • Publish Date:
                    • Publish Location: New York

                    “Integrated packaging systems for transportation and distribution” Subjects and Themes:

                    Edition Identifiers:

                    Access and General Info:

                    • First Year Published: 1990
                    • Is Full Text Available: No
                    • Is The Book Public: No
                    • Access Status: No_ebook

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                    20Run-to-run control in semiconductor manufacturing

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                    Book's cover

                    “Run-to-run control in semiconductor manufacturing” Metadata:

                    • Title: ➤  Run-to-run control in semiconductor manufacturing
                    • Author:
                    • Language: English
                    • Number of Pages: Median: 348
                    • Publisher: CRC Press
                    • Publish Date:
                    • Publish Location: Boca Raton

                    “Run-to-run control in semiconductor manufacturing” Subjects and Themes:

                    Edition Identifiers:

                    Access and General Info:

                    • First Year Published: 2001
                    • Is Full Text Available: No
                    • Is The Book Public: No
                    • Access Status: Unclassified

                    Online Access

                    Downloads Are Not Available:

                    The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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                      21Guidebook for managing silicon chip reliability

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                      Book's cover

                      “Guidebook for managing silicon chip reliability” Metadata:

                      • Title: ➤  Guidebook for managing silicon chip reliability
                      • Author:
                      • Language: English
                      • Number of Pages: Median: 214
                      • Publisher: CRC Press
                      • Publish Date:
                      • Publish Location: Boca Raton, Fla

                      “Guidebook for managing silicon chip reliability” Subjects and Themes:

                      Edition Identifiers:

                      Access and General Info:

                      • First Year Published: 1999
                      • Is Full Text Available: No
                      • Is The Book Public: No
                      • Access Status: No_ebook

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                      22Air cooling technology for electronic equipment

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                      Book's cover

                      “Air cooling technology for electronic equipment” Metadata:

                      • Title: ➤  Air cooling technology for electronic equipment
                      • Author:
                      • Language: English
                      • Number of Pages: Median: 251
                      • Publisher: CRC Press
                      • Publish Date:
                      • Publish Location: Boca Raton

                      “Air cooling technology for electronic equipment” Subjects and Themes:

                      Edition Identifiers:

                      Access and General Info:

                      • First Year Published: 1996
                      • Is Full Text Available: Yes
                      • Is The Book Public: No
                      • Access Status: Printdisabled

                      Online Access

                      Downloads Are Not Available:

                      The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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                        23Adhesives technology for electronic applications

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                        “Adhesives technology for electronic applications” Metadata:

                        • Title: ➤  Adhesives technology for electronic applications
                        • Author:
                        • Language: English
                        • Number of Pages: Median: 403
                        • Publisher: William Andrew Pub.
                        • Publish Date:
                        • Publish Location: Amsterdam - Boston

                        “Adhesives technology for electronic applications” Subjects and Themes:

                        Edition Identifiers:

                        Access and General Info:

                        • First Year Published: 2011
                        • Is Full Text Available: No
                        • Is The Book Public: No
                        • Access Status: No_ebook

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