Explore: Heat Sinks (electronics)
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AI-Generated Overview About “heat-sinks-%28electronics%29”:
Books Results
Source: The Open Library
The Open Library Search Results
Search results from The Open Library
1CAE/CAD and thermal management issues in electronic systems
By D. Agonafer

“CAE/CAD and thermal management issues in electronic systems” Metadata:
- Title: ➤ CAE/CAD and thermal management issues in electronic systems
- Author: D. Agonafer
- Language: English
- Number of Pages: Median: 109
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 1997
- Publish Location: New York
“CAE/CAD and thermal management issues in electronic systems” Subjects and Themes:
- Subjects: ➤ Transmission - Temperature control - Electronic packaging - Heat - Design - Electronic apparatus and appliances - Data processing - Heat sinks (Electronics) - Congresses - Computer-aided engineering - Cad/cam systems - Computer-aided design
Edition Identifiers:
- The Open Library ID: OL451767M
- Online Computer Library Center (OCLC) ID: 38156158
- Library of Congress Control Number (LCCN): 98166447
- All ISBNs: 9780791818527 - 0791818527
Access and General Info:
- First Year Published: 1997
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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22005 Proceedings of the 3rd International Conference on Microchannels and Minichannels
By American Society of Mechanical Engineers

“2005 Proceedings of the 3rd International Conference on Microchannels and Minichannels” Metadata:
- Title: ➤ 2005 Proceedings of the 3rd International Conference on Microchannels and Minichannels
- Author: ➤ American Society of Mechanical Engineers
- Language: English
- Number of Pages: Median: 2
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2005
“2005 Proceedings of the 3rd International Conference on Microchannels and Minichannels” Subjects and Themes:
- Subjects: Heat - Congresses - Transmission - Heat sinks (Electronics)
Edition Identifiers:
- The Open Library ID: OL11151214M
- Library of Congress Control Number (LCCN): 2006272384
- All ISBNs: 0791841855 - 9780791841853
Author's Alternative Names:
"American Society Mechanical Engineers", "American Society of Mechanical Engineers.", "American Society Of Mechanical Engineers", "The American Society Of Mechanical Engineers" and "American Society of Mechanical Engineers (ASME)"Access and General Info:
- First Year Published: 2005
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Borrowable
Online Access
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The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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- Borrowing from Open Library: Borrowing link
- Borrowing from Archive.org: Borrowing link
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3Encyclopedia of Thermal Packaging
By Avram Bar-Cohen
“Encyclopedia of Thermal Packaging” Metadata:
- Title: ➤ Encyclopedia of Thermal Packaging
- Author: Avram Bar-Cohen
- Language: English
- Number of Pages: Median: 1375
- Publisher: ➤ World Scientific Publishing Co Pte Ltd
- Publish Date: 2012 - 2014 - 2019
“Encyclopedia of Thermal Packaging” Subjects and Themes:
- Subjects: ➤ Electronic packaging - Insulation (heat) - Heat sinks (Electronics) - Insulation (Heat) - Mise sous boîtier (Électronique) - Dissipateurs thermiques (Électronique)
Edition Identifiers:
- The Open Library ID: ➤ OL49260812M - OL34565343M - OL49255462M - OL34565340M - OL49255469M - OL28482295M - OL49261874M - OL49252491M - OL49249495M - OL34565345M - OL28482833M - OL34565339M - OL34565342M - OL49261125M - OL34565341M
- Online Computer Library Center (OCLC) ID: 840254753
- All ISBNs: ➤ 9814313785 - 9789814327657 - 981432762X - 9813239719 - 9789814313841 - 9814313823 - 9789814327633 - 9814327603 - 9789814327619 - 9789814583435 - 9814313815 - 9789814313780 - 9813239697 - 9789813239715 - 9814327638 - 9789814327626 - 9789813239739 - 9814313831 - 9813239735 - 9789814327602 - 9789814313810 - 9814313807 - 9789814313827 - 9789814313803 - 9789814313834 - 9814327611 - 981458343X - 9814327654 - 9789813239692 - 981431384X
Access and General Info:
- First Year Published: 2012
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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4Design and analysisof heat sinks
By Allan D. Kraus

“Design and analysisof heat sinks” Metadata:
- Title: ➤ Design and analysisof heat sinks
- Author: Allan D. Kraus
- Language: English
- Number of Pages: Median: 407
- Publisher: ➤ Wiley-Interscience - John Wiley - Wiley - Wiley & Sons, Incorporated, John
- Publish Date: 1995 - 2008
- Publish Location: New York - Chichester
“Design and analysisof heat sinks” Subjects and Themes:
- Subjects: Heat sinks (Electronics) - Design and construction - Microelectronics - Electronics - Commercial law
Edition Identifiers:
- The Open Library ID: OL29169117M - OL22165994M - OL796999M
- Online Computer Library Center (OCLC) ID: 32703902 - 32821035
- Library of Congress Control Number (LCCN): 95032934
- All ISBNs: 9780471017554 - 9780470300763 - 0470300760 - 0471017558
Access and General Info:
- First Year Published: 1995
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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5Heat transfer
By Younes Shabany
“Heat transfer” Metadata:
- Title: Heat transfer
- Author: Younes Shabany
- Language: English
- Number of Pages: Median: 523
- Publisher: ➤ Taylor & Francis Group - Taylor & Francis
- Publish Date: 2009 - 2010
- Publish Location: Boca Raton
“Heat transfer” Subjects and Themes:
- Subjects: ➤ Protection - Electronic apparatus and appliances - System failures (Engineering) - Heat sinks (Electronics) - Prevention - Thermal properties - Electronic packaging - Heat, transmission - Thermodynamics - Materials, thermal properties - Appareils électroniques - Propriétés thermiques - Dissipateurs thermiques (Électronique) - Mise sous boîtier (Électronique) - Pannes - Prévention - TECHNOLOGY & ENGINEERING - Mechanical - Wärmeübertragung
Edition Identifiers:
- The Open Library ID: OL23935574M - OL29012691M - OL33663190M
- Online Computer Library Center (OCLC) ID: 869567322
- Library of Congress Control Number (LCCN): 2009042415
- All ISBNs: ➤ 1439814678 - 9781439814673 - 9781439814680 - 9780429092220 - 0429092229 - 1439814686
Access and General Info:
- First Year Published: 2009
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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6Phase Change Material Based Heat Sinks
By Srikanth Rangarajan and C. Balaji
“Phase Change Material Based Heat Sinks” Metadata:
- Title: ➤ Phase Change Material Based Heat Sinks
- Authors: Srikanth RangarajanC. Balaji
- Language: English
- Number of Pages: Median: 197
- Publisher: Taylor & Francis Group
- Publish Date: 2019
“Phase Change Material Based Heat Sinks” Subjects and Themes:
- Subjects: ➤ Heat sinks (Electronics) - Dissipateurs thermiques (Électronique) - SCIENCE / Mechanics / Dynamics / Thermodynamics - TECHNOLOGY / Electricity - TECHNOLOGY / Electronics / General
Edition Identifiers:
- The Open Library ID: OL33681387M - OL33713011M - OL33712972M - OL33712486M - OL33760825M
- Online Computer Library Center (OCLC) ID: 1129702352
- All ISBNs: ➤ 9781000752830 - 9780367344030 - 9781000752922 - 1000753018 - 1000752836 - 9781000753011 - 0429325576 - 9780429325571 - 0367344033 - 1000752925
Access and General Info:
- First Year Published: 2019
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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7Advanced Thermal Management Materials
By Guosheng Jiang

“Advanced Thermal Management Materials” Metadata:
- Title: ➤ Advanced Thermal Management Materials
- Author: Guosheng Jiang
- Language: English
- Number of Pages: Median: 162
- Publisher: ➤ Imprint: Springer - Springer - Springer New York
- Publish Date: 2012 - 2013 - 2014
- Publish Location: New York, NY
“Advanced Thermal Management Materials” Subjects and Themes:
- Subjects: ➤ Heat and Mass Transfer Engineering Thermodynamics - Energy Efficiency (incl. Buildings) - Instrumentation Electronics and Microelectronics - Power (Mechanics) - Engineering - Materials - Metallic Materials - Force and energy - Power resources - Electronics - Microelectronic packaging - Thermal properties - Microelectronics - Cooling - Heat sinks (Electronics) - Electronic apparatus and appliances - Electronic packaging - Electric engineering - Heat, transmission
Edition Identifiers:
- The Open Library ID: OL36211407M - OL34372037M - OL30613463M - OL27014701M
- Library of Congress Control Number (LCCN): 2012944176
- All ISBNs: ➤ 1461419646 - 1461419638 - 146141962X - 9781461419648 - 9781461419631 - 9781489992543 - 1489992545 - 9781461419624
Access and General Info:
- First Year Published: 2012
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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8Cae - CAD Application to Electronic Packaging
By D. Agonafer

“Cae - CAD Application to Electronic Packaging” Metadata:
- Title: ➤ Cae - CAD Application to Electronic Packaging
- Author: D. Agonafer
- Language: English
- Number of Pages: Median: 89
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 1994
- Publish Location: New York, N.Y
“Cae - CAD Application to Electronic Packaging” Subjects and Themes:
- Subjects: Heat sinks (Electronics) - Congresses - Electronic packaging
Edition Identifiers:
- The Open Library ID: OL18084178M - OL11150944M - OL17684684M
- All ISBNs: 0791814602 - 9780791814604
Access and General Info:
- First Year Published: 1994
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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9Analysis of ultimate-heat-sink spray ponds
By R. Codell
“Analysis of ultimate-heat-sink spray ponds” Metadata:
- Title: ➤ Analysis of ultimate-heat-sink spray ponds
- Author: R. Codell
- Language: English
- Publisher: ➤ Available from GPO Sales Program, Division of Technical Information and Document Control, U.S. Nuclear Regulatory Commission - National Technical Information Service - Division of Engineering, Office of Nuclear Reactor Regulation, U.S. Nuclear Regulatory Commission
- Publish Date: 1981
- Publish Location: ➤ Springfield, Va - Washington, D.C
“Analysis of ultimate-heat-sink spray ponds” Subjects and Themes:
- Subjects: ➤ Computer programs - Cooling ponds - Heat sinks (Electronics) - Evaporation (Meteorology) - Measurement - Climatic factors
Edition Identifiers:
- The Open Library ID: OL22392143M - OL14947875M - OL17984501M
Access and General Info:
- First Year Published: 1981
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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10Microchannels and minichannels (ICMM2004)
By International Conference on Microchannels and Minichannels (2nd 2004 Rochester, N.Y.), S. G. Kandlikar and G. P. Celata

“Microchannels and minichannels (ICMM2004)” Metadata:
- Title: ➤ Microchannels and minichannels (ICMM2004)
- Authors: ➤ International Conference on Microchannels and Minichannels (2nd 2004 Rochester, N.Y.)S. G. KandlikarG. P. Celata
- Language: English
- Number of Pages: Median: 1005
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2004
- Publish Location: New York, N.Y
“Microchannels and minichannels (ICMM2004)” Subjects and Themes:
- Subjects: ➤ Congresses - Transmission - Heat sinks (Electronics) - Heat - Engineering - Mechanical - Technology - Technology & Industrial Arts - Science/Mathematics
Edition Identifiers:
- The Open Library ID: OL7804958M - OL22599691M - OL18214630M
- Library of Congress Control Number (LCCN): 2004556976
- All ISBNs: 9780791841648 - 0791841642
Access and General Info:
- First Year Published: 2004
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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11ITherm 2002
By InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (8th 2002 San Diego, Calif.)
“ITherm 2002” Metadata:
- Title: ITherm 2002
- Author: ➤ InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (8th 2002 San Diego, Calif.)
- Language: English
- Number of Pages: Median: 1115
- Publisher: Ieee - IEEE
- Publish Date: 2001 - 2002
- Publish Location: Piscataway, N.J
“ITherm 2002” Subjects and Themes:
- Subjects: Congresses - Heat sinks (Electronics) - Thermal properties - Electronic apparatus and appliances - Ball grid array technology
Edition Identifiers:
- The Open Library ID: OL11000211M - OL20525108M
- Online Computer Library Center (OCLC) ID: 50234650
- All ISBNs: 9780780371538 - 9780780371521 - 0780371534 - 0780371526
Access and General Info:
- First Year Published: 2001
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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12Proceedings of the 6th International Conference on Nanochannels, Microchannels and Minichannels, 2008
presented at 6th International Conference on Nanochannels, Microchannels and Minichannels, June 23-25, 2008, Darmstadt, Germany ; sponsored by ASME.
By International Conference on Nanochannels, Microchannels and Minichannels (6th 2008 Darmstadt, Germany)
“Proceedings of the 6th International Conference on Nanochannels, Microchannels and Minichannels, 2008” Metadata:
- Title: ➤ Proceedings of the 6th International Conference on Nanochannels, Microchannels and Minichannels, 2008
- Author: ➤ International Conference on Nanochannels, Microchannels and Minichannels (6th 2008 Darmstadt, Germany)
- Language: English
- Number of Pages: Median: 1948
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2008
- Publish Location: New York
“Proceedings of the 6th International Conference on Nanochannels, Microchannels and Minichannels, 2008” Subjects and Themes:
- Subjects: ➤ Congresses - Microelectromechanical systems - Condensation - Transmission - Microfluidics - Heat - Fluidic devices - Heat sinks (Electronics) - Biomedical engineering
Edition Identifiers:
- The Open Library ID: OL23866455M - OL24006503M
- Library of Congress Control Number (LCCN): 2009417519
- All ISBNs: 0791848345 - 9780791848340
Access and General Info:
- First Year Published: 2008
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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13Heat convection in micro ducts
By Yitshak Zohar

“Heat convection in micro ducts” Metadata:
- Title: Heat convection in micro ducts
- Author: Yitshak Zohar
- Language: English
- Number of Pages: Median: 202
- Publisher: Kluwer Academic
- Publish Date: 2003
- Publish Location: Boston
“Heat convection in micro ducts” Subjects and Themes:
- Subjects: Heat - Heat sinks (Electronics) - Transmission - Heat, transmission
Edition Identifiers:
- The Open Library ID: OL18187541M
- Online Computer Library Center (OCLC) ID: 50519145
- Library of Congress Control Number (LCCN): 2002034172
- All ISBNs: 1402072562 - 9781402072567
Access and General Info:
- First Year Published: 2003
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Printdisabled
Online Access
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14Thermal Phenomena in Electronic Systems (I-THERM), 1998 Intersociety Conference
By Institute of Electrical and Electronics Engineers
“Thermal Phenomena in Electronic Systems (I-THERM), 1998 Intersociety Conference” Metadata:
- Title: ➤ Thermal Phenomena in Electronic Systems (I-THERM), 1998 Intersociety Conference
- Author: ➤ Institute of Electrical and Electronics Engineers
- Language: English
- Number of Pages: Median: 500
- Publisher: ➤ Institute of Electrical & Electronics Enginee
- Publish Date: 1998
“Thermal Phenomena in Electronic Systems (I-THERM), 1998 Intersociety Conference” Subjects and Themes:
- Subjects: ➤ Electronic apparatus and appliances - Thermal properties - Congresses - Heat sinks (Electronics) - Ball grid array technology
Edition Identifiers:
- The Open Library ID: OL10999191M
- Online Computer Library Center (OCLC) ID: 39517951
- All ISBNs: 9780780344754 - 0780344758
Author's Alternative Names:
"Institute of Electrical & Electronics En", "Institute of Electrical and Electronics Engineers", "IEEE" and "Ieee"Access and General Info:
- First Year Published: 1998
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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15Itherm 2000
By Nev.) InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th : 2000 : Las Vegas

“Itherm 2000” Metadata:
- Title: Itherm 2000
- Author: ➤ Nev.) InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th : 2000 : Las Vegas
- Language: English
- Number of Pages: Median: 560
- Publisher: ➤ Institute of Electrical & Electronics Enginee
- Publish Date: 2000
“Itherm 2000” Subjects and Themes:
- Subjects: ➤ Electronic apparatus and appliances - Thermal properties - Congresses - Heat sinks (Electronics) - Ball grid array technology
Edition Identifiers:
- The Open Library ID: OL10999728M
- Online Computer Library Center (OCLC) ID: 44760997
- All ISBNs: 9780780359123 - 0780359127
Access and General Info:
- First Year Published: 2000
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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16Heat transfer over a vertical melting plate
By Yin-Chao Yen
“Heat transfer over a vertical melting plate” Metadata:
- Title: ➤ Heat transfer over a vertical melting plate
- Author: Yin-Chao Yen
- Language: English
- Number of Pages: Median: 12
- Publisher: ➤ Corps of Engineers, U.S. Army, Cold Regions Research and Engineering Laboratory
- Publish Date: 1977
- Publish Location: Hanover, N.H
“Heat transfer over a vertical melting plate” Subjects and Themes:
- Subjects: Heat sinks (Electronics) - Heat-transfer media
Edition Identifiers:
- The Open Library ID: OL17547634M
Access and General Info:
- First Year Published: 1977
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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17First International Conference on Microchannels and Minichannels
By International Conference on Microchannels and Minichannels (1st 2003 Rochester, N.Y.)

“First International Conference on Microchannels and Minichannels” Metadata:
- Title: ➤ First International Conference on Microchannels and Minichannels
- Author: ➤ International Conference on Microchannels and Minichannels (1st 2003 Rochester, N.Y.)
- Language: English
- Number of Pages: Median: 989
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2003
- Publish Location: New York, N.Y
“First International Conference on Microchannels and Minichannels” Subjects and Themes:
- Subjects: Congresses - Heat - Heat sinks (Electronics) - Transmission
Edition Identifiers:
- The Open Library ID: OL3778494M
- Online Computer Library Center (OCLC) ID: 52510408 - 52501314
- Library of Congress Control Number (LCCN): 2003545327
- All ISBNs: 0791836673 - 9780791836675
Access and General Info:
- First Year Published: 2003
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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18Proceedings of the ASME 10th International Conference on Nanochannels, Microchannels and Minichannels--2012
By International Conference on Nanochannels, Microchannels and Minichannels (10th 2012 Rio Grande, Puerto Rico)
“Proceedings of the ASME 10th International Conference on Nanochannels, Microchannels and Minichannels--2012” Metadata:
- Title: ➤ Proceedings of the ASME 10th International Conference on Nanochannels, Microchannels and Minichannels--2012
- Author: ➤ International Conference on Nanochannels, Microchannels and Minichannels (10th 2012 Rio Grande, Puerto Rico)
- Language: English
- Number of Pages: Median: 856
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2012
- Publish Location: New York
“Proceedings of the ASME 10th International Conference on Nanochannels, Microchannels and Minichannels--2012” Subjects and Themes:
- Subjects: ➤ Fluidic devices - Congresses - Microfluidics - Microelectromechanical systems - Heat - Transmission - Heat sinks (Electronics) - Condensation - Biomedical engineering
Edition Identifiers:
- The Open Library ID: OL31083852M
- Online Computer Library Center (OCLC) ID: 822561541
- Library of Congress Control Number (LCCN): 2012554738
- All ISBNs: 079184479X - 9780791844793
Access and General Info:
- First Year Published: 2012
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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19The market for electronics thermal management technologies
By Andrea Dace
“The market for electronics thermal management technologies” Metadata:
- Title: ➤ The market for electronics thermal management technologies
- Author: Andrea Dace
- Language: English
- Number of Pages: Median: 174
- Publisher: Business Communications Co.
- Publish Date: 2000
- Publish Location: Norwalk, CT
“The market for electronics thermal management technologies” Subjects and Themes:
- Subjects: ➤ Insulating materials industry - Electric insulators and insulation - Electronic packaging - Microelectronics industry - Electronic apparatus and appliances - Temperature control - Heat sinks (Electronics) - Market surveys
Edition Identifiers:
- The Open Library ID: OL31592502M
- Library of Congress Control Number (LCCN): 2003272189
- All ISBNs: 9781569657096 - 1569657092
Access and General Info:
- First Year Published: 2000
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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20The market for electronics thermal management technologies
By Ravi Krishnan
“The market for electronics thermal management technologies” Metadata:
- Title: ➤ The market for electronics thermal management technologies
- Author: Ravi Krishnan
- Language: English
- Number of Pages: Median: 315
- Publisher: Business Communications Co.
- Publish Date: 2002
- Publish Location: Norwalk, CT
“The market for electronics thermal management technologies” Subjects and Themes:
- Subjects: ➤ Insulating materials industry - Electric insulators and insulation - Electronic packaging - Microelectronics industry - Electronic apparatus and appliances - Temperature control - Heat sinks (Electronics) - Market surveys
Edition Identifiers:
- The Open Library ID: OL31641245M
- Library of Congress Control Number (LCCN): 2005281949
- All ISBNs: 1569659710 - 9781569659717
Access and General Info:
- First Year Published: 2002
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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21Hot markets
By Marc Favreau
“Hot markets” Metadata:
- Title: Hot markets
- Author: Marc Favreau
- Language: English
- Number of Pages: Median: 165
- Publisher: Business Communications Co.
- Publish Date: 1996
- Publish Location: Norwalk, CT
“Hot markets” Subjects and Themes:
- Subjects: Heat sinks (Electronics) - Cooling - Market surveys - Microelectronics industry - Electronic apparatus and appliances
Edition Identifiers:
- The Open Library ID: OL555113M
- Online Computer Library Center (OCLC) ID: 34776247
- Library of Congress Control Number (LCCN): 96137409
- All ISBNs: 9781569652312 - 1569652317
Access and General Info:
- First Year Published: 1996
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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22Proceedings of the 9th International Conference on Nanochannels, Microchannels and Minichannels--2011
By International Conference on Nanochannels, Microchannels and Minichannels (9th 2011 Edmonton, Canada)
“Proceedings of the 9th International Conference on Nanochannels, Microchannels and Minichannels--2011” Metadata:
- Title: ➤ Proceedings of the 9th International Conference on Nanochannels, Microchannels and Minichannels--2011
- Author: ➤ International Conference on Nanochannels, Microchannels and Minichannels (9th 2011 Edmonton, Canada)
- Language: English
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2012
- Publish Location: New York
“Proceedings of the 9th International Conference on Nanochannels, Microchannels and Minichannels--2011” Subjects and Themes:
- Subjects: ➤ Microelectromechanical systems - Condensation - Transmission - Microfluidics - Heat - Congresses - Fluidic devices - Heat sinks (Electronics) - Biomedical engineering
Edition Identifiers:
- The Open Library ID: OL30733578M
- Online Computer Library Center (OCLC) ID: 798103169
- Library of Congress Control Number (LCCN): 2012472428
- All ISBNs: 0791844641 - 9780791844632 - 0791844633 - 9780791844649
Access and General Info:
- First Year Published: 2012
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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23Application of CAE/CAD to electronic systems
By D. Agonafer
“Application of CAE/CAD to electronic systems” Metadata:
- Title: ➤ Application of CAE/CAD to electronic systems
- Author: D. Agonafer
- Language: English
- Number of Pages: Median: 123
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 1996
- Publish Location: New York, N.Y
“Application of CAE/CAD to electronic systems” Subjects and Themes:
- Subjects: ➤ Cooling - Congresses - CAD/CAM systems - Heat sinks (Electronics) - Computer-aided design - Computer-aided engineering - Electronic packaging
Edition Identifiers:
- The Open Library ID: OL1020416M
- Online Computer Library Center (OCLC) ID: 36245397
- Library of Congress Control Number (LCCN): 96079040
- All ISBNs: 9780791815533 - 0791815536
Access and General Info:
- First Year Published: 1996
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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24Silicon microchannel heat sinks
By L. Zhang, K.E. Goodson and T.W. Kenny

“Silicon microchannel heat sinks” Metadata:
- Title: ➤ Silicon microchannel heat sinks
- Authors: L. ZhangK.E. GoodsonT.W. Kenny
- Language: English
- Number of Pages: Median: 140
- Publisher: Springer
- Publish Date: 2004
“Silicon microchannel heat sinks” Subjects and Themes:
- Subjects: ➤ Heat sinks (Electronics) - Transmission - Semiconductors - Cooling - Heat - Heat, transmission
Edition Identifiers:
- The Open Library ID: OL9702639M
- Online Computer Library Center (OCLC) ID: 53223656
- Library of Congress Control Number (LCCN): 2003062031
- All ISBNs: 9783540401810 - 3540401814
First Setence:
"In 1965, Dr. Moore of Intel Corporation predicted that the number of transistors on an integrated circuit would double every 18 months, known as "Moore's Law" [1.1]."
Access and General Info:
- First Year Published: 2004
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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25Proceedings of the 7th International Conference on Nanochannels, Microchannels and Minichannels, 2009
By International Conference on Nanochannels, Microchannels and Minichannels (7th 2009 Pohang, South Korea)
“Proceedings of the 7th International Conference on Nanochannels, Microchannels and Minichannels, 2009” Metadata:
- Title: ➤ Proceedings of the 7th International Conference on Nanochannels, Microchannels and Minichannels, 2009
- Author: ➤ International Conference on Nanochannels, Microchannels and Minichannels (7th 2009 Pohang, South Korea)
- Language: English
- Number of Pages: Median: 1457
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2009
- Publish Location: New York
“Proceedings of the 7th International Conference on Nanochannels, Microchannels and Minichannels, 2009” Subjects and Themes:
- Subjects: ➤ Microelectromechanical systems - Condensation - Transmission - Microfluidics - Heat - Congresses - Fluidic devices - Heat sinks (Electronics) - Biomedical engineering
Edition Identifiers:
- The Open Library ID: OL24480231M
- Online Computer Library Center (OCLC) ID: 472868419
- Library of Congress Control Number (LCCN): 2010279313
- All ISBNs: 9780791843499 - 0791843491
Access and General Info:
- First Year Published: 2009
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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26ITherm'98
By InterSociety Conference on Thermal Phenomena in Electronic Systems (6th 1998 Seattle, Washington)
“ITherm'98” Metadata:
- Title: ITherm'98
- Author: ➤ InterSociety Conference on Thermal Phenomena in Electronic Systems (6th 1998 Seattle, Washington)
- Language: English
- Number of Pages: Median: 541
- Publisher: IEEE
- Publish Date: 1998
- Publish Location: Piscataway, New Jersey
“ITherm'98” Subjects and Themes:
- Subjects: Congresses - Heat sinks (Electronics) - Thermal properties - Electronic apparatus and appliances - Ball grid array technology
Edition Identifiers:
- The Open Library ID: OL18119229M
- All ISBNs: ➤ 9780780344778 - 0780344758 - 0780344774 - 9780780344754 - 0780344766 - 9780780344761
Access and General Info:
- First Year Published: 1998
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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27I-THERM V
By InterSociety Conference on Thermal Phenomena in Electronic Systems (5th 1996 Orlando, Fla.)

“I-THERM V” Metadata:
- Title: I-THERM V
- Author: ➤ InterSociety Conference on Thermal Phenomena in Electronic Systems (5th 1996 Orlando, Fla.)
- Language: English
- Number of Pages: Median: 407
- Publisher: ➤ IEEE Service Center [distributor] - Institute of Electrical and Electronics Engineers
- Publish Date: 1996
- Publish Location: [New York] - Piscataway, NJ
“I-THERM V” Subjects and Themes:
- Subjects: Congresses - Heat sinks (Electronics) - Thermal properties - Electronic apparatus and appliances - Ball grid array technology
Edition Identifiers:
- The Open Library ID: OL18087649M
- All ISBNs: 9780780333253 - 0780333268 - 078033325X - 9780780333260
Access and General Info:
- First Year Published: 1996
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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28Heat sink effects on weld bead
By Paul O. Steranka
“Heat sink effects on weld bead” Metadata:
- Title: Heat sink effects on weld bead
- Author: Paul O. Steranka
- Language: English
- Publisher: ➤ National Technical Information Service, distributor - National Aeronautics and Space Administration - National Institute for Aviation Research, Wichita State University
- Publish Date: 1990
- Publish Location: ➤ Springfield, Va - Wichita, Kan - [Washington, DC
“Heat sink effects on weld bead” Subjects and Themes:
- Subjects: Heat sinks (Electronics)
Edition Identifiers:
- The Open Library ID: OL15397955M
Access and General Info:
- First Year Published: 1990
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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29Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels-- 2006
By International Conference on Nanochannels, Microchannels and Minichannels (4th 2006 Limerick, Ireland)

“Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels-- 2006” Metadata:
- Title: ➤ Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels-- 2006
- Author: ➤ International Conference on Nanochannels, Microchannels and Minichannels (4th 2006 Limerick, Ireland)
- Language: English
- Number of Pages: Median: 1394
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2006
- Publish Location: New York
“Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels-- 2006” Subjects and Themes:
- Subjects: ➤ Congresses - Microelectromechanical systems - Heat - Fluidic devices - Transmission - Microfluidics - Heat sinks (Electronics)
Edition Identifiers:
- The Open Library ID: OL17164011M
- Library of Congress Control Number (LCCN): 2007295373
- All ISBNs: 0791847608 - 9780791847602
Access and General Info:
- First Year Published: 2006
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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30Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005
By International Conference on Microchannels and Minichannels (3rd 2005 Toronto, Ont.)
“Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005” Metadata:
- Title: ➤ Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005
- Author: ➤ International Conference on Microchannels and Minichannels (3rd 2005 Toronto, Ont.)
- Language: English
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2005
- Publish Location: New York
“Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005” Subjects and Themes:
- Subjects: Congresses - Transmission - Heat sinks (Electronics) - Heat
Edition Identifiers:
- The Open Library ID: OL22726141M
- All ISBNs: 0791841855 - 9780791841853
Access and General Info:
- First Year Published: 2005
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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31Proceedings of the 5th International Conference on Nanochannels, Microchannels and Minichannels-- 2007
By International Conference on Nanochannels, Microchannels and Minichannels (5th 2007 Puebla, Mexico)
“Proceedings of the 5th International Conference on Nanochannels, Microchannels and Minichannels-- 2007” Metadata:
- Title: ➤ Proceedings of the 5th International Conference on Nanochannels, Microchannels and Minichannels-- 2007
- Author: ➤ International Conference on Nanochannels, Microchannels and Minichannels (5th 2007 Puebla, Mexico)
- Language: English
- Number of Pages: Median: 1164
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2007
- Publish Location: New York
“Proceedings of the 5th International Conference on Nanochannels, Microchannels and Minichannels-- 2007” Subjects and Themes:
- Subjects: ➤ Fluidic devices - Congresses - Microfluidics - Microelectromechanical systems - Heat - Transmission - Heat sinks (Electronics) - Optics - DNA - Condensation
Edition Identifiers:
- The Open Library ID: OL23156465M
- Library of Congress Control Number (LCCN): 2008297459
- All ISBNs: 9780791842720 - 079184272X
Access and General Info:
- First Year Published: 2007
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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32ITherm 2000
By InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th 2000 Las Vegas, Nev.)

“ITherm 2000” Metadata:
- Title: ITherm 2000
- Author: ➤ InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (7th 2000 Las Vegas, Nev.)
- Language: English
- Publisher: IEEE
- Publish Date: 2000
- Publish Location: Piscataway, New Jersey
“ITherm 2000” Subjects and Themes:
- Subjects: Congresses - Heat sinks (Electronics) - Thermal properties - Electronic apparatus and appliances - Ball grid array technology
Edition Identifiers:
- The Open Library ID: OL18141164M
- All ISBNs: ➤ 9780780359130 - 0780359135 - 0780359143 - 0780359127 - 9780780359147 - 9780780359123
Access and General Info:
- First Year Published: 2000
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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33Reliability of materials for the thermal management of electronics
By Risto Hienonen
“Reliability of materials for the thermal management of electronics” Metadata:
- Title: ➤ Reliability of materials for the thermal management of electronics
- Author: Risto Hienonen
- Language: English
- Number of Pages: Median: 113
- Publisher: ➤ VTT Technical Research Centre of Finland
- Publish Date: 2006
- Publish Location: [Espoo, Finland]
“Reliability of materials for the thermal management of electronics” Subjects and Themes:
- Subjects: ➤ Thermal interface materials - Cooling - Thermal conductivity - Electronic apparatus and appliances - Heat sinks (Electronics) - Impedance (Electricity)
Edition Identifiers:
- The Open Library ID: OL16149230M
- All ISBNs: 9513868710 - 9789513868710
Access and General Info:
- First Year Published: 2006
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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34Analysis of ultimate heat sink cooling ponds
By R. Codell
“Analysis of ultimate heat sink cooling ponds” Metadata:
- Title: ➤ Analysis of ultimate heat sink cooling ponds
- Author: R. Codell
- Language: English
- Number of Pages: Median: 105
- Publisher: ➤ Available from GPO Sales Program, Division of Technical Information and Document Control, U.S. Nuclear Regulatory Commission - National Technical Information Service - Division of Engineering, Office of Nuclear Reactor Regulation, U.S. Nuclear Regulatory Commission
- Publish Date: 1980
- Publish Location: ➤ Springfield, Va - Washington, D.C
“Analysis of ultimate heat sink cooling ponds” Subjects and Themes:
- Subjects: ➤ Computer programs - Evaporation control - Heat sinks (Electronics) - Evaporation (Meteorology) - Climatic factors - Cooling ponds
Edition Identifiers:
- The Open Library ID: OL14989924M
Access and General Info:
- First Year Published: 1980
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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35Comparison between field data and ultimate heat sink cooling pond and spray pond models
By R. Codell
“Comparison between field data and ultimate heat sink cooling pond and spray pond models” Metadata:
- Title: ➤ Comparison between field data and ultimate heat sink cooling pond and spray pond models
- Author: R. Codell
- Language: English
- Number of Pages: Median: 59
- Publisher: ➤ Division of Engineering, Office of Nuclear Reactor Regulation, U.S. Nuclear Regulatory Commission
- Publish Date: 1982
- Publish Location: Washington, D.C
“Comparison between field data and ultimate heat sink cooling pond and spray pond models” Subjects and Themes:
- Subjects: Heat sinks (Electronics) - Cooling ponds
Edition Identifiers:
- The Open Library ID: OL14947998M
Access and General Info:
- First Year Published: 1982
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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36Intersociety Conference on Thermal Phenomena in Electronic Systems: I-Therm V : Proceedings 1996
By Institute of Electrical and Electronics Engineers

“Intersociety Conference on Thermal Phenomena in Electronic Systems: I-Therm V : Proceedings 1996” Metadata:
- Title: ➤ Intersociety Conference on Thermal Phenomena in Electronic Systems: I-Therm V : Proceedings 1996
- Author: ➤ Institute of Electrical and Electronics Engineers
- Language: English
- Number of Pages: Median: 407
- Publisher: ➤ Institute of Electrical & Electronics Enginee
- Publish Date: 1996
“Intersociety Conference on Thermal Phenomena in Electronic Systems: I-Therm V : Proceedings 1996” Subjects and Themes:
- Subjects: ➤ Electronic apparatus and appliances - Thermal properties - Congresses - Heat sinks (Electronics) - Ball grid array technology
Edition Identifiers:
- The Open Library ID: OL10998942M
- Online Computer Library Center (OCLC) ID: 35314999
- All ISBNs: 078033325X - 9780780333253
Author's Alternative Names:
"Institute of Electrical & Electronics En", "Institute of Electrical and Electronics Engineers", "IEEE" and "Ieee"Access and General Info:
- First Year Published: 1996
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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37Proceedings of the 8th International Conference on Nanochannels, Microchannels and Minichannels--2010
By International Conference on Nanochannels, Microchannels and Minichannels (8th 2010 Montréal, Québec)
“Proceedings of the 8th International Conference on Nanochannels, Microchannels and Minichannels--2010” Metadata:
- Title: ➤ Proceedings of the 8th International Conference on Nanochannels, Microchannels and Minichannels--2010
- Author: ➤ International Conference on Nanochannels, Microchannels and Minichannels (8th 2010 Montréal, Québec)
- Language: English
- Number of Pages: Median: 1784
- Publisher: ➤ American Society of Mechanical Engineers
- Publish Date: 2011
- Publish Location: New York
“Proceedings of the 8th International Conference on Nanochannels, Microchannels and Minichannels--2010” Subjects and Themes:
- Subjects: ➤ Microelectromechanical systems - Condensation - Transmission - Microfluidics - Heat - Congresses - Fluidic devices - Heat sinks (Electronics) - Biomedical engineering
Edition Identifiers:
- The Open Library ID: OL25314219M
- Online Computer Library Center (OCLC) ID: 701243257
- Library of Congress Control Number (LCCN): 2011286668
- All ISBNs: 9780791854501 - 0791854507
Access and General Info:
- First Year Published: 2011
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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38A method to predict the thermal performance of printed circuit board mounted solid state devices
By Matthew D. Kelleher

“A method to predict the thermal performance of printed circuit board mounted solid state devices” Metadata:
- Title: ➤ A method to predict the thermal performance of printed circuit board mounted solid state devices
- Author: Matthew D. Kelleher
- Language: English
- Number of Pages: Median: 53
- Publisher: Naval Postgraduate School
- Publish Date: 1975
- Publish Location: Monterey, Calif
“A method to predict the thermal performance of printed circuit board mounted solid state devices” Subjects and Themes:
- Subjects: ➤ Heat sinks (Electronics) - Cooling - Electronic apparatus and appliances - Semiconductors
Edition Identifiers:
- The Open Library ID: OL25474820M
- Online Computer Library Center (OCLC) ID: 429904319
Access and General Info:
- First Year Published: 1975
- Is Full Text Available: Yes
- Is The Book Public: Yes
- Access Status: Public
Online Access
Online Borrowing:
- Borrowing from Open Library: Borrowing link
- Borrowing from Archive.org: Borrowing link
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