Explore: Thermal Interface Materials

A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between

Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste

attachment methods and thermal interface materials also affect the die temperature of the integrated circuit. Thermal adhesive or thermal paste improve the heat

rate in materials of low thermal conductivity than in materials of high thermal conductivity. For instance, metals typically have high thermal conductivity

way to the electrical case. A thermal interface material or mastic (aka TIM) is used to fill the gaps between thermal transfer surfaces, such as between

RoHS compliant. The current version of the company's eponymous thermal interface material, Arctic Silver 5, is a compound of silver, aluminum oxide, zinc

and electronics, thermal pads (also called thermally conductive pad or thermal interface pad) are pre-formed rectangles of solid material (often paraffin

as thermal interface materials (TIM) due to their high conductance, which they report as ~10^5 W/m^2/K. Thermal interface materials are materials that

Thermal conduction is the diffusion of thermal energy (heat) within one material or between materials in contact. The higher temperature object has molecules

Interfacial thermal resistance, also known as thermal boundary resistance, or Kapitza resistance, is a measure of resistance to thermal flow at the interface between