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Source: The Open Library

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1Welding for engineers

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Book's cover

“Welding for engineers” Metadata:

  • Title: Welding for engineers
  • Author:
  • Language: English
  • Number of Pages: Median: 430
  • Publisher: ➤  Wiley - Creative Media Partners, LLC
  • Publish Date:
  • Publish Location: New York

“Welding for engineers” Subjects and Themes:

Edition Identifiers:

Access and General Info:

  • First Year Published: 1954
  • Is Full Text Available: Yes
  • Is The Book Public: No
  • Access Status: Borrowable

Online Access

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The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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2Lead Finishing in Semiconductor Devices

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Book's cover

“Lead Finishing in Semiconductor Devices” Metadata:

  • Title: ➤  Lead Finishing in Semiconductor Devices
  • Author:
  • Language: English
  • Number of Pages: Median: 268
  • Publisher: World Scientific Pub Co Inc
  • Publish Date:

“Lead Finishing in Semiconductor Devices” Subjects and Themes:

Edition Identifiers:

First Setence:

"The wave soldering operation is an integral part of the backend operation of 1C assembly process where the device leads are soldered in a wave soldering machine."

Access and General Info:

  • First Year Published: 1989
  • Is Full Text Available: Yes
  • Is The Book Public: No
  • Access Status: Borrowable

Online Access

Downloads Are Not Available:

The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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3Fusing fun

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Book's cover

“Fusing fun” Metadata:

  • Title: Fusing fun
  • Authors:
  • Language: English
  • Publisher: Cke Pubns
  • Publish Date:

“Fusing fun” Subjects and Themes:

Edition Identifiers:

Access and General Info:

  • First Year Published: 1987
  • Is Full Text Available: Yes
  • Is The Book Public: No
  • Access Status: Borrowable

Online Access

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The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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4Kiln Formed Bracelets

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Book's cover

“Kiln Formed Bracelets” Metadata:

  • Title: Kiln Formed Bracelets
  • Author:
  • Language: English
  • Number of Pages: Median: 79
  • Publisher: Wardell Publications
  • Publish Date:

“Kiln Formed Bracelets” Subjects and Themes:

Edition Identifiers:

Access and General Info:

  • First Year Published: 2005
  • Is Full Text Available: Yes
  • Is The Book Public: No
  • Access Status: Borrowable

Online Access

Downloads Are Not Available:

The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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5Metallurgy of Welding

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Book's cover

“Metallurgy of Welding” Metadata:

  • Title: Metallurgy of Welding
  • Author:
  • Language: English
  • Number of Pages: Median: 451
  • Publisher: ➤  Abington Publishing - Springer - Elsevier Science & Technology - Springer London, Limited
  • Publish Date:

“Metallurgy of Welding” Subjects and Themes:

Edition Identifiers:

Access and General Info:

  • First Year Published: 1999
  • Is Full Text Available: Yes
  • Is The Book Public: No
  • Access Status: Printdisabled

Online Access

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    6Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

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    Book's cover

    “Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices” Metadata:

    • Title: ➤  Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
    • Author:
    • Language: English
    • Number of Pages: Median: 344
    • Publisher: ➤  CRC Press - CRC Press LLC - Taylor & Francis Group
    • Publish Date:

    “Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices” Subjects and Themes:

    Edition Identifiers:

    Access and General Info:

    • First Year Published: 2020
    • Is Full Text Available: No
    • Is The Book Public: No
    • Access Status: No_ebook

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    7Electrically conductive adhesives

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    “Electrically conductive adhesives” Metadata:

    • Title: ➤  Electrically conductive adhesives
    • Author:
    • Language: English
    • Number of Pages: Median: 425
    • Publisher: VSP
    • Publish Date:
    • Publish Location: Leiden - Boston

    “Electrically conductive adhesives” Subjects and Themes:

    Edition Identifiers:

    Access and General Info:

    • First Year Published: 2008
    • Is Full Text Available: No
    • Is The Book Public: No
    • Access Status: No_ebook

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    8Soldering

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    “Soldering” Metadata:

    • Title: Soldering
    • Author:
    • Language: English
    • Publisher: A S M International
    • Publish Date:

    “Soldering” Subjects and Themes:

    Edition Identifiers:

    Access and General Info:

    • First Year Published: 2014
    • Is Full Text Available: No
    • Is The Book Public: No
    • Access Status: No_ebook

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    9Lead-Free Soldering in Electronics

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    Book's cover

    “Lead-Free Soldering in Electronics” Metadata:

    • Title: ➤  Lead-Free Soldering in Electronics
    • Author:
    • Language: English
    • Number of Pages: Median: 376
    • Publisher: CRC - Marcel Dekker, Inc.
    • Publish Date:
    • Publish Location: New York

    “Lead-Free Soldering in Electronics” Subjects and Themes:

    Edition Identifiers:

    First Setence:

    "Environmentally friendly technologies found within the industries at the forefront of the age of electronics and automobiles are destined to become one of the key facets of technology for the new era."

    Access and General Info:

    • First Year Published: 2003
    • Is Full Text Available: No
    • Is The Book Public: No
    • Access Status: No_ebook

    Online Access

    Downloads Are Not Available:

    The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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      10Lead-free solder interconnect reliability

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      Book's cover

      “Lead-free solder interconnect reliability” Metadata:

      • Title: ➤  Lead-free solder interconnect reliability
      • Author:
      • Language: English
      • Publisher: ASM International
      • Publish Date:
      • Publish Location: Materials Park, OH

      “Lead-free solder interconnect reliability” Subjects and Themes:

      Edition Identifiers:

      Access and General Info:

      • First Year Published: 2005
      • Is Full Text Available: No
      • Is The Book Public: No
      • Access Status: No_ebook

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      11Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

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      Book's cover

      “Handbook of Lead-Free Solder Technology for Microelectronic Assemblies” Metadata:

      • Title: ➤  Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
      • Author:
      • Language: English
      • Publisher: Marcel Dekker, Inc.
      • Publish Date:
      • Publish Location: New York

      “Handbook of Lead-Free Solder Technology for Microelectronic Assemblies” Subjects and Themes:

      Edition Identifiers:

      Access and General Info:

      • First Year Published: 2004
      • Is Full Text Available: No
      • Is The Book Public: No
      • Access Status: No_ebook

      Online Access

      Downloads Are Not Available:

      The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.

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