Explore: Mise Sous Boîtier (microélectronique)
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Books Results
Source: The Open Library
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Search results from The Open Library
1Introduction to microsystem packaging technology
By Yufeng Jin
“Introduction to microsystem packaging technology” Metadata:
- Title: ➤ Introduction to microsystem packaging technology
- Author: Yufeng Jin
- Language: English
- Number of Pages: Median: 232
- Publisher: ➤ Taylor & Francis - Taylor & Francis Group
- Publish Date: 2010 - 2017 - 2018
- Publish Location: Boca Raton
“Introduction to microsystem packaging technology” Subjects and Themes:
- Subjects: ➤ Microelectronic packaging - Electronic packaging - Mise sous boîtier (Microélectronique) - TECHNOLOGY & ENGINEERING - Electronics - Digital - Microelectronics
Edition Identifiers:
- The Open Library ID: ➤ OL33762691M - OL24044892M - OL33689341M - OL33616688M - OL33749786M - OL33395122M - OL23954024M - OL33517461M
- Online Computer Library Center (OCLC) ID: 727983482 - 377864839
- Library of Congress Control Number (LCCN): 2009045580
- All ISBNs: ➤ 9781322612171 - 1138374253 - 1351824287 - 132261217X - 1351832972 - 9781439865972 - 9781315217086 - 9781138374256 - 1315217082 - 9781351832977 - 1439819106 - 9781439819104 - 9781351824286 - 1439865973
Access and General Info:
- First Year Published: 2010
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
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2Mems
By Vikas Choudhary and Krzysztof Iniewski
“Mems” Metadata:
- Title: Mems
- Authors: Vikas ChoudharyKrzysztof Iniewski
- Language: English
- Number of Pages: Median: 478
- Publisher: ➤ Taylor & Francis Group - CRC Press,Taylor & Francis Group
- Publish Date: 2013 - 2017
“Mems” Subjects and Themes:
- Subjects: ➤ Microelectromechanical systems - Electronic packaging - Microelectronic packaging - MEDICAL / Biotechnology - TECHNOLOGY & ENGINEERING / Electronics / Circuits / General - TECHNOLOGY & ENGINEERING / Nanotechnology & MEMS - Micro-Electrical-Mechanical Systems - Microsystèmes électromécaniques - Mise sous boîtier (Microélectronique) - MEDICAL - Biotechnology - TECHNOLOGY & ENGINEERING - Electronics - Circuits - General - Nanotechnology & MEMS - Digital - Microelectronics
Edition Identifiers:
- The Open Library ID: ➤ OL33548853M - OL28875560M - OL28771806M - OL34604998M - OL33762271M - OL33749771M - OL33778402M
- Online Computer Library Center (OCLC) ID: 848941560 - 818461710
- Library of Congress Control Number (LCCN): 2013001258
- All ISBNs: ➤ 9781138072305 - 1466515813 - 135183228X - 9781466515826 - 9781299710078 - 9781466515819 - 1299710077 - 1138072303 - 9781351823593 - 1315216396 - 1351823590 - 9781315216393 - 9781351832281 - 1466515821
Access and General Info:
- First Year Published: 2013
- Is Full Text Available: Yes
- Is The Book Public: No
- Access Status: Printdisabled
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
Online Borrowing:
Online Marketplaces
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3Influence of temperature on microelectronics and system reliability
By Pradeep Lall
“Influence of temperature on microelectronics and system reliability” Metadata:
- Title: ➤ Influence of temperature on microelectronics and system reliability
- Author: Pradeep Lall
- Language: English
- Number of Pages: Median: 336
- Publisher: ➤ CRC Press - Taylor & Francis Group
- Publish Date: 1997 - 2019 - 2020
- Publish Location: Boca Raton
“Influence of temperature on microelectronics and system reliability” Subjects and Themes:
- Subjects: ➤ Reliability - Electronic apparatus and appliances - Materials - Microelectronics - Thermal properties - Electronic packaging - Microelectronic packaging - Microélectronique - Matériaux - Propriétés thermiques - Mise sous boîtier (Microélectronique) - Appareils électroniques - Fiabilité - TECHNOLOGY - Electricity
Edition Identifiers:
- The Open Library ID: OL1000154M - OL30179633M - OL34661523M - OL30180993M - OL30179630M
- Online Computer Library Center (OCLC) ID: 1176298419
- Library of Congress Control Number (LCCN): 96039038
- All ISBNs: ➤ 0429600070 - 0367400979 - 9780849394508 - 9780429605598 - 0429605595 - 0849394503 - 9780367400972 - 0429611110 - 9780429611117 - 9780429600074
Access and General Info:
- First Year Published: 1997
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
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4MEMS packaging
By Tai-Ran Hsu
“MEMS packaging” Metadata:
- Title: MEMS packaging
- Author: Tai-Ran Hsu
- Language: English
- Number of Pages: Median: 275
- Publisher: ➤ INSPEC - Institution of Engineering & Technology
- Publish Date: 2004
- Publish Location: London
“MEMS packaging” Subjects and Themes:
- Subjects: ➤ Microelectromechanical systems - Microelectronic packaging - Microsystèmes électromécaniques - Mise sous boîtier (Microélectronique) - Bauelement - Mikroelektronik - Mikromechanik
Edition Identifiers:
- The Open Library ID: OL44882979M - OL35768642M - OL18986353M
- Online Computer Library Center (OCLC) ID: 729386039 - 692197050 - 53030765
- Library of Congress Control Number (LCCN): 2014415226
- All ISBNs: ➤ 9781615839629 - 0863413358 - 9781849190626 - 1849190623 - 1615839623 - 9780863413353
Access and General Info:
- First Year Published: 2004
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
Online Borrowing:
Online Marketplaces
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5Microwave and millimeter-wave electronic packaging
By Rick Sturdivant
“Microwave and millimeter-wave electronic packaging” Metadata:
- Title: ➤ Microwave and millimeter-wave electronic packaging
- Author: Rick Sturdivant
- Language: English
- Number of Pages: Median: 261
- Publisher: Artech House
- Publish Date: 2014
- Publish Location: Boston
“Microwave and millimeter-wave electronic packaging” Subjects and Themes:
- Subjects: ➤ Microelectronic packaging - Mise sous boîtier (Microélectronique) - TECHNOLOGY & ENGINEERING - Mechanical - Electronic packaging - Microwave devices - Design and construction - Millimeter wave devices
Edition Identifiers:
- The Open Library ID: OL31271994M
- Online Computer Library Center (OCLC) ID: 922474990 - 868082231
- Library of Congress Control Number (LCCN): 2013362455
- All ISBNs: 9781608076970 - 1608076970
Access and General Info:
- First Year Published: 2014
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
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6Microelectronic packaging
By Madhav Datta
“Microelectronic packaging” Metadata:
- Title: Microelectronic packaging
- Author: Madhav Datta
- Language: English
- Number of Pages: Median: 542
- Publisher: CRC Press
- Publish Date: 2005
- Publish Location: Boca Raton
“Microelectronic packaging” Subjects and Themes:
- Subjects: ➤ Microelectronic packaging - Electronic packaging - Mise sous boîtier (Microélectronique) - TECHNOLOGY & ENGINEERING - Electronics - Microelectronics - Digital
Edition Identifiers:
- The Open Library ID: OL17144811M
- Online Computer Library Center (OCLC) ID: 62777603
- Library of Congress Control Number (LCCN): 2004050337
- All ISBNs: 041531190X - 9780415311908
Access and General Info:
- First Year Published: 2005
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
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7Lead-free solder interconnect reliability
By Dongkai Shangguan
“Lead-free solder interconnect reliability” Metadata:
- Title: ➤ Lead-free solder interconnect reliability
- Author: Dongkai Shangguan
- Language: English
- Publisher: ASM International
- Publish Date: 2005
- Publish Location: Materials Park, OH
“Lead-free solder interconnect reliability” Subjects and Themes:
- Subjects: ➤ Lead-free electronics manufacturing processes - Reliability - Solder and soldering - Microelectronic packaging - Manufacturing processes - Mise sous boîtier (Microélectronique) - Fiabilité - Soudure - Solder - TECHNOLOGY & ENGINEERING - Electronics - Digital - Microelectronics
Edition Identifiers:
- The Open Library ID: OL3426324M
- Online Computer Library Center (OCLC) ID: 60543308 - 729262390
- Library of Congress Control Number (LCCN): 2005050106
- All ISBNs: 9780871708168 - 0871708167
Access and General Info:
- First Year Published: 2005
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
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