"Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging" - Information and Links:

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"Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging" was published by Taylor & Francis Group in 2017, it has 322 pages and the language of the book is English.


“Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging” Metadata:

  • Title: ➤  Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
  • Author:
  • Language: English
  • Number of Pages: 322
  • Publisher: Taylor & Francis Group
  • Publish Date:

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