Explore: Electronics Packaging
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AI-Generated Overview About “electronics-packaging”:
Books Results
Source: The Open Library
The Open Library Search Results
Search results from The Open Library
1Reliability of Power Electronic Converter Systems
By Henry Shu-hung Chung, Huai Wang, Frede Blaabjerg and Michael Pecht
“Reliability of Power Electronic Converter Systems” Metadata:
- Title: ➤ Reliability of Power Electronic Converter Systems
- Authors: Henry Shu-hung ChungHuai WangFrede BlaabjergMichael Pecht
- Language: English
- Number of Pages: Median: 496
- Publisher: ➤ Institution of Engineering & Technology
- Publish Date: 2015 - 2016 - 2025
“Reliability of Power Electronic Converter Systems” Subjects and Themes:
- Subjects: ➤ Reliability (engineering) - Electric current converters - Reliability (Engineering) - Fiabilité - TECHNOLOGY & ENGINEERING - Mechanical - Electronics packaging - Photovoltaic power systems - Power convertors - Reliability - Variable speed drives - Wind turbines
Edition Identifiers:
- The Open Library ID: OL57582546M - OL35945553M - OL37238811M
- Online Computer Library Center (OCLC) ID: 934769940
- All ISBNs: ➤ 1849199027 - 9781839539411 - 1839539410 - 9781849199025 - 1849199019 - 9781849199018
Access and General Info:
- First Year Published: 2015
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
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2RF and Microwave Module Level Design and Integration
By Mohammad Almalkawi
“RF and Microwave Module Level Design and Integration” Metadata:
- Title: ➤ RF and Microwave Module Level Design and Integration
- Author: Mohammad Almalkawi
- Language: English
- Number of Pages: Median: 336
- Publisher: ➤ Institution of Engineering & Technology
- Publish Date: 2019
“RF and Microwave Module Level Design and Integration” Subjects and Themes:
- Subjects: ➤ Radio, transmitters and transmission - Radio, receivers and reception - Microwave circuits - Radio frequency - Computer-aided design - Electric circuits - Passive Electric networks - Electronic circuit design - Electronic packaging - Impedance matching - Lumped elements (Electronics) - Conception assistée par ordinateur - Circuits électriques - Réseaux passifs (Télécommunications) - Circuits électroniques - Calcul - Mise sous boîtier (Électronique) - Adaptation d'impédance - Constantes localisées (Électronique) - Circuits pour micro-ondes - Computer-aided designs (visual works) - Circuits - Circuit CAD - Electromagnetic coupling - Electronics packaging - Lumped parameter networks - Modules - Passive networks
Edition Identifiers:
- The Open Library ID: OL35976837M - OL29431750M
- Online Computer Library Center (OCLC) ID: 1112093460
- All ISBNs: 9781785613593 - 178561360X - 1785613596 - 9781785613609
Access and General Info:
- First Year Published: 2019
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
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- Amazon: Audiable, Kindle and printed editions.
- Ebay: New & used books.
3Electronic Scanned Array Design
By Williams, John S.
“Electronic Scanned Array Design” Metadata:
- Title: ➤ Electronic Scanned Array Design
- Author: Williams, John S.
- Language: English
- Publisher: ➤ Institution of Engineering & Technology - SciTech Publishing, Incorporated
- Publish Date: 2021
“Electronic Scanned Array Design” Subjects and Themes:
- Subjects: ➤ Aperture antennas - Electronic packaging - Engineering design - Microwave integrated circuits - Radar - Antennas - Antennes à ouverture rayonnante - Mise sous boîtier (Électronique) - Conception technique - Circuits intégrés pour micro-ondes - Antennes - Antenna phased arrays - Design engineering - Electronics packaging - MMIC - Radar antennas - Reflector antenna feeds
Edition Identifiers:
- The Open Library ID: OL35992811M - OL37311847M
- Online Computer Library Center (OCLC) ID: 1233056667
- All ISBNs: 9781785619304 - 1785619306 - 1785619292 - 9781785619298
Access and General Info:
- First Year Published: 2021
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
Find Electronic Scanned Array Design at online marketplaces:
- Amazon: Audiable, Kindle and printed editions.
- Ebay: New & used books.
Wiki
Source: Wikipedia
Wikipedia Results
Search Results from Wikipedia
List of electronic component packaging types
List of electronics package dimensions Redistribution layer Small-outline transistor Wafer-level packaging "CPU Collection Museum - Chip Package Information"
Institute of Electrical and Electronics Engineers
Technology Society Circuits and Systems Society Communications Society Electronics Packaging Society Computational Intelligence Society Computer Society Consumer
Integrated circuit packaging
controlled environment. Advanced packaging (semiconductors) List of electronic component packaging types List of electronics package dimensions Gold–aluminium
Digital electronics
Digital electronics Digital electronics is a field of electronics involving the study of digital signals and the engineering of devices that use or produce
Centre for Materials for Electronics Technology
indigenous LTCC tapes and pastes for high‑density packaging used in microwave, aerospace, MEMS and IC packaging applications. C‑MET’s Hyderabad laboratory hosts
Fast-moving consumer goods
Category management Mass production Trade promotion management Shelf-ready packaging "Consumer Goods Industry News, Research & Events". Consumer Goods Technology
IPC (electronics)
Institute for Interconnecting and Packaging Electronic Circuits to highlight the expansion from bare boards to packaging and electronic assemblies. In 1999
Applied Materials
company also supplies equipment to produce coatings for flexible electronics, packaging and other applications. The company is headquartered in Santa Clara
Nova Chemicals
are used in a wide variety of applications, including food and electronics packaging, industrial materials, appliances and a variety of consumer goods
Risk matrix
maintenance, printing and publishing, cybersecurity, offshore operations, electronics, packaging, and industrial engineering. Several recent studies have shown that