Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments - Info and Reading Options
By Juan Cepeda-Rizo, Jeremiah Gayle and Joshua Ravich
"Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments" was published by CRC Press LLC in 2022 and the language of the book is English.
“Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments” Metadata:
- Title: ➤ Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments
- Authors: Juan Cepeda-RizoJeremiah GayleJoshua Ravich
- Language: English
- Publisher: CRC Press LLC
- Publish Date: 2022
“Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments” Subjects and Themes:
- Subjects: ➤ Electronic packaging - Electronic apparatus and appliances - Reliability - Space vehicles - Electronic equipment - Design and construction - Extreme environments - Mise sous boîtier (Électronique) - Appareils électroniques - Fiabilité - Milieux extrêmes - TECHNOLOGY / Engineering / Civil - TECHNOLOGY / Engineering / Mechanical
Edition Identifiers:
- The Open Library ID: OL36097473M - OL25340546W
- ISBN-13: 9781032160856
- All ISBNs: 9781032160856
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