Explore: Chemical Mechanical Planarization
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Source: The Open Library
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1Nanoparticle engineering for chemical-mechanical planarization
By Ungyu Paik
“Nanoparticle engineering for chemical-mechanical planarization” Metadata:
- Title: ➤ Nanoparticle engineering for chemical-mechanical planarization
- Author: Ungyu Paik
- Language: English
- Number of Pages: Median: 222
- Publisher: ➤ CRC - Taylor & Francis - Taylor & Francis Group - CRC Press
- Publish Date: 2008 - 2009 - 2019
“Nanoparticle engineering for chemical-mechanical planarization” Subjects and Themes:
- Subjects: ➤ Nanoelectronics - Chemical mechanical planarization - Nanoparticles - Nanotechnology - Nanostructured materials - Microelectronics - Planarisation chimicomécanique - Nanoparticules - Nanoélectronique - SCIENCE / Chemistry / Industrial & Technical - TECHNOLOGY / Electronics / Microelectronics - TECHNOLOGY / Engineering / Chemical & Biochemical
Edition Identifiers:
- The Open Library ID: ➤ OL31367946M - OL29459429M - OL29459419M - OL33678548M - OL29034986M - OL33758029M - OL11816712M - OL29453036M
- Online Computer Library Center (OCLC) ID: 1104036011 - 277040881
- Library of Congress Control Number (LCCN): 2008051282
- All ISBNs: ➤ 9781420059137 - 0429291892 - 1420059114 - 1000013367 - 9781000023367 - 9781000006544 - 1000006549 - 100002329X - 9781000013368 - 9781420059113 - 1000023222 - 9781000023299 - 1420059130 - 9780429291890 - 1000023362 - 9781000023220
Access and General Info:
- First Year Published: 2008
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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2Tribology in chemical-mechanical planarization
By Hong Liang, Hong Liang and David Craven
“Tribology in chemical-mechanical planarization” Metadata:
- Title: ➤ Tribology in chemical-mechanical planarization
- Authors: Hong LiangHong LiangDavid Craven
- Language: English
- Number of Pages: Median: 199
- Publisher: ➤ Taylor & Francis Group - Taylor & Francis - CRC
- Publish Date: 2005 - 2019
- Publish Location: Boca Raton, Fla
“Tribology in chemical-mechanical planarization” Subjects and Themes:
- Subjects: ➤ Tribology - Grinding and polishing - Technology: General Issues - Power Tools - Science - Home Improvement / Construction - Science/Mathematics - Engineering - General - Material Science - Technology / Material Science - Chemistry - General - Chemical mechanical planarization - Tribologie (Technologie) - Planarisation chimicomécanique - HOUSE & HOME
Edition Identifiers:
- The Open Library ID: ➤ OL22626705M - OL33699475M - OL34582674M - OL33435145M - OL34658550M - OL8125356M
- Online Computer Library Center (OCLC) ID: 56419342 - 77566887
- Library of Congress Control Number (LCCN): 2004058221
- All ISBNs: ➤ 0824725670 - 1420028391 - 128051678X - 0429120087 - 9780824725679 - 0367393255 - 9780367393250 - 9780429120084 - 9781280516788 - 9781420028393
First Setence:
"In the microelectronics community, the acronym CMP has been interpreted as either chemical-mechanical polishing or chemical-mechanical planarization."
Access and General Info:
- First Year Published: 2005
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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3Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses
By Christopher L. Borst, Christopher Lyle Borst, William N. Gill and Ronald J. Gutmann
“Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses” Metadata:
- Title: ➤ Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses
- Authors: Christopher L. BorstChristopher Lyle BorstWilliam N. GillRonald J. Gutmann
- Language: English
- Number of Pages: Median: 243
- Publisher: ➤ Springer - Kluwer Academic Publishers - Springer London, Limited
- Publish Date: 2002 - 2013 - 2014
- Publish Location: Boston
“Chemical-mechanical polishing of low dielectric constant polymers and organosilicate glasses” Subjects and Themes:
- Subjects: ➤ Polishing - Semiconductors - Grinding and polishing - Interconnects (Integrated circuit technology) - Plastics & polymers technology - Science/Mathematics - Integrated Circuits - Technology - Technology & Industrial Arts - Chemistry - Organic - Electronics - Semiconductors - Engineering - Electrical & Electronic - Science-Chemistry - Organic - Technology / Electronics / Semiconductors - Technology / Engineering / Industrial - Technology-Engineering - Electrical & Electronic - Electronics - Circuits - Integrated - Interconnects (Integrated circ - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL18179337M - OL8372442M - OL27997496M - OL37239970M
- Library of Congress Control Number (LCCN): 2002028782
- All ISBNs: ➤ 9781461511656 - 1402071930 - 1461354242 - 9781402071935 - 9781461354246 - 1461511658
First Setence:
"For many years integrated circuit (IC) interconnect structures were relatively simple, as the main IC processing concern was fabrication of higher density transistors."
Access and General Info:
- First Year Published: 2002
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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4Microelectronic Applications of Chemical Mechanical Planarization
By Yuzhuo Li
“Microelectronic Applications of Chemical Mechanical Planarization” Metadata:
- Title: ➤ Microelectronic Applications of Chemical Mechanical Planarization
- Author: Yuzhuo Li
- Language: English
- Number of Pages: Median: 747
- Publisher: ➤ Wiley & Sons, Incorporated, John - Wiley & Sons Canada, Limited, John - Wiley-Interscience
- Publish Date: 2007
“Microelectronic Applications of Chemical Mechanical Planarization” Subjects and Themes:
- Subjects: ➤ Materials - Chemical mechanical planarization - Microelectronics - Integrated circuits - Design and construction - Grinding and polishing
Edition Identifiers:
- The Open Library ID: OL48641831M - OL39978929M - OL29040984M - OL10334924M
- Library of Congress Control Number (LCCN): 2007015557
- All ISBNs: ➤ 9780470180907 - 1281094161 - 0470180897 - 9781281094162 - 0471719196 - 9780470180891 - 9780471719199 - 0470180900
Access and General Info:
- First Year Published: 2007
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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5Chemical mechanical planarization of microelectronic materials
By Joseph M. Steigerwald
“Chemical mechanical planarization of microelectronic materials” Metadata:
- Title: ➤ Chemical mechanical planarization of microelectronic materials
- Author: Joseph M. Steigerwald
- Language: English
- Number of Pages: Median: 337
- Publisher: ➤ Wiley & Sons, Incorporated, John - Wiley & Sons, Limited, John - J. Wiley
- Publish Date: 1997 - 2007 - 2008
- Publish Location: New York
“Chemical mechanical planarization of microelectronic materials” Subjects and Themes:
Edition Identifiers:
- The Open Library ID: OL29024955M - OL28999223M - OL969625M
- Online Computer Library Center (OCLC) ID: 232367859 - 34285050
- Library of Congress Control Number (LCCN): 96006198
- All ISBNs: ➤ 9780471138273 - 0471138274 - 3527617744 - 9783527617753 - 9783527617746 - 3527617752
Access and General Info:
- First Year Published: 1997
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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6Chemical Mechanical Planarization of Semiconductor Materials
By M.R. Oliver
“Chemical Mechanical Planarization of Semiconductor Materials” Metadata:
- Title: ➤ Chemical Mechanical Planarization of Semiconductor Materials
- Author: M.R. Oliver
- Language: English
- Number of Pages: Median: 425
- Publisher: Springer
- Publish Date: 2004
“Chemical Mechanical Planarization of Semiconductor Materials” Subjects and Themes:
Edition Identifiers:
- The Open Library ID: OL9057612M
- Online Computer Library Center (OCLC) ID: 52765846
- Library of Congress Control Number (LCCN): 2003059075
- All ISBNs: 3540431810 - 9783540431817
Access and General Info:
- First Year Published: 2004
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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7Chemical-Mechanical Polishing 2001--Advances and Future Challenges
By Jane K. Corbin
“Chemical-Mechanical Polishing 2001--Advances and Future Challenges” Metadata:
- Title: ➤ Chemical-Mechanical Polishing 2001--Advances and Future Challenges
- Author: Jane K. Corbin
- Language: English
- Number of Pages: Median: 304
- Publisher: Materials Research Society
- Publish Date: 2001
- Publish Location: Warrendale, Pa
“Chemical-Mechanical Polishing 2001--Advances and Future Challenges” Subjects and Themes:
- Subjects: Grinding and polishing - Metals, pickling - Electrolytic polishing - Congresses - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL3584321M - OL8609086M
- Online Computer Library Center (OCLC) ID: 49240901
- Library of Congress Control Number (LCCN): 2002282222
- All ISBNs: 1558996079 - 9781558996076
Access and General Info:
- First Year Published: 2001
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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8Advances in Chemical Mechanical Planarization (CMP)
By Suryadevara Babu
“Advances in Chemical Mechanical Planarization (CMP)” Metadata:
- Title: ➤ Advances in Chemical Mechanical Planarization (CMP)
- Author: Suryadevara Babu
- Language: English
- Number of Pages: Median: 536
- Publisher: Elsevier Science & Technology
- Publish Date: 2016
“Advances in Chemical Mechanical Planarization (CMP)” Subjects and Themes:
- Subjects: ➤ Semiconductors - Grinding and polishing - Chemical mechanical planarization - Nanoelectronics - Microelectronics - Miniaturization - Planarisation chimicomécanique - Nanoélectronique - Microélectronique - TECHNOLOGY & ENGINEERING - Mechanical
Edition Identifiers:
- The Open Library ID: OL28588268M - OL34509341M
- Online Computer Library Center (OCLC) ID: 934626626
- All ISBNs: 0081001657 - 9780081002186 - 9780081001653 - 0081002181
Access and General Info:
- First Year Published: 2016
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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9Handōtai CMP yōgo jiten
“Handōtai CMP yōgo jiten” Metadata:
- Title: Handōtai CMP yōgo jiten
- Language: jpn
- Number of Pages: Median: 262
- Publisher: Ōmusha
- Publish Date: 2008
- Publish Location: Tōkyō
“Handōtai CMP yōgo jiten” Subjects and Themes:
- Subjects: ➤ Chemical mechanical planarization - Grinding and polishing - Dictionaries - Japanese - Semiconductors
Edition Identifiers:
- The Open Library ID: OL24005549M - OL23874372M
- Library of Congress Control Number (LCCN): 2009352356
- All ISBNs: 9784274206122 - 4274206122
Access and General Info:
- First Year Published: 2008
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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10Chemical-Mechanical Planarization
By Michael R. Oliver, Duane S. Boning and Ingrid Vos
“Chemical-Mechanical Planarization” Metadata:
- Title: ➤ Chemical-Mechanical Planarization
- Authors: Michael R. OliverDuane S. BoningIngrid Vos
- Language: English
- Number of Pages: Median: 356
- Publisher: ➤ University of Cambridge ESOL Examinations - Materials Research Society - Cambridge University Press
- Publish Date: 2003 - 2014
- Publish Location: Warrendale, Pa
“Chemical-Mechanical Planarization” Subjects and Themes:
- Subjects: ➤ Electronic circuit design - Microelectronics - Semiconductors - Metals, pickling - Congresses - Materials - Grinding and polishing - Metals - Pickling - Surfaces - Chemical Mechanical Planarization
Edition Identifiers:
- The Open Library ID: OL3325827M - OL29206060M
- Online Computer Library Center (OCLC) ID: 53191183
- Library of Congress Control Number (LCCN): 2004299462
- All ISBNs: 9781558997042 - 9781107409415 - 1107409411 - 1558997040
Access and General Info:
- First Year Published: 2003
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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11Chemical-mechanical polishing, fundamentals and challenges
By S. V. Babu and S. Danyluk
“Chemical-mechanical polishing, fundamentals and challenges” Metadata:
- Title: ➤ Chemical-mechanical polishing, fundamentals and challenges
- Authors: S. V. BabuS. Danyluk
- Language: English
- Number of Pages: Median: 281
- Publisher: Materials Research Society
- Publish Date: 1999 - 2000
- Publish Location: Warrendale, Pa
“Chemical-mechanical polishing, fundamentals and challenges” Subjects and Themes:
- Subjects: Electrolytic polishing - Grinding and polishing - Congresses - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL22398335M - OL12091936M
- Online Computer Library Center (OCLC) ID: 42892234
- Library of Congress Control Number (LCCN): 99058801
- All ISBNs: 9781558994737 - 1558994734
Access and General Info:
- First Year Published: 1999
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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12Chemical-Mechanical Planarization--Integration, Technology and Reliability
By Ashok Kumar
“Chemical-Mechanical Planarization--Integration, Technology and Reliability” Metadata:
- Title: ➤ Chemical-Mechanical Planarization--Integration, Technology and Reliability
- Author: Ashok Kumar
- Language: English
- Number of Pages: Median: 302
- Publisher: Materials Research Society
- Publish Date: 2005
“Chemical-Mechanical Planarization--Integration, Technology and Reliability” Subjects and Themes:
- Subjects: ➤ Microelectronics - Grinding and polishing - Metals, pickling - Semiconductors - Congresses - Materials - Metals - Pickling - Surfaces - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL12092043M
- Online Computer Library Center (OCLC) ID: 61263882
- Library of Congress Control Number (LCCN): 2005285362
- All ISBNs: 9781558998209 - 1558998209
Access and General Info:
- First Year Published: 2005
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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13Chemical Mechanical Polishing Equipment and Materials
By Business Communications Co.
“Chemical Mechanical Polishing Equipment and Materials” Metadata:
- Title: ➤ Chemical Mechanical Polishing Equipment and Materials
- Author: Business Communications Co.
- Language: English
- Number of Pages: Median: 166
- Publisher: ➤ Business Communications Company
- Publish Date: 2003
“Chemical Mechanical Polishing Equipment and Materials” Subjects and Themes:
- Subjects: ➤ Cleaning compounds industry - Grinding and polishing - Equipment and supplies - Electrolytic polishing - Semiconductors - Polishing - Cleaning - Market surveys - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL12194466M
- Online Computer Library Center (OCLC) ID: 61865850
- Library of Congress Control Number (LCCN): 2005281946
- All ISBNs: 9781569659731 - 1569659737
Access and General Info:
- First Year Published: 2003
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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14Chemical Mechanical Planarization in Ic Device Manufacturing (Proceedings / Electrochemical Society)
By R. L. Opila
“Chemical Mechanical Planarization in Ic Device Manufacturing (Proceedings / Electrochemical Society)” Metadata:
- Title: ➤ Chemical Mechanical Planarization in Ic Device Manufacturing (Proceedings / Electrochemical Society)
- Author: R. L. Opila
- Language: English
- Number of Pages: Median: 273
- Publisher: Electrochemical Society
- Publish Date: 1998
“Chemical Mechanical Planarization in Ic Device Manufacturing (Proceedings / Electrochemical Society)” Subjects and Themes:
- Subjects: ➤ Surfaces - Chemical mechanical planarization - Semiconductors - Pickling - Microelectronics - Metals - Materials - Congresses - Grinding and polishing
Edition Identifiers:
- The Open Library ID: OL8671047M
- Library of Congress Control Number (LCCN): 99196375
- All ISBNs: 9781566772013 - 156677201X
Access and General Info:
- First Year Published: 1998
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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15Chemical Mechanical Planarization in IC Device Manufaturing III
By I. Ali, Y. A. Arimoto, Y. Homma, C. Reidsema-Simpson, K. B. Sundaram R. L. Opila
“Chemical Mechanical Planarization in IC Device Manufaturing III” Metadata:
- Title: ➤ Chemical Mechanical Planarization in IC Device Manufaturing III
- Author: ➤ I. Ali, Y. A. Arimoto, Y. Homma, C. Reidsema-Simpson, K. B. Sundaram R. L. Opila
- Language: English
- Number of Pages: Median: 644
- Publisher: ➤ The Electrochemical Society, Inc.
- Publish Date: 2000
“Chemical Mechanical Planarization in IC Device Manufaturing III” Subjects and Themes:
- Subjects: ➤ Surfaces - Chemical mechanical planarization - Semiconductors - Pickling - Microelectronics - Metals - Materials - Congresses - Grinding and polishing
Edition Identifiers:
- The Open Library ID: OL12163722M
- Library of Congress Control Number (LCCN): 00100975
- All ISBNs: 1566772605 - 9781566772600
Access and General Info:
- First Year Published: 2000
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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16Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues
By Calif.) Chemical-Mechanical Polishing 200 (2000 San Francisco
“Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues” Metadata:
- Title: ➤ Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues
- Author: ➤ Calif.) Chemical-Mechanical Polishing 200 (2000 San Francisco
- Language: English
- Number of Pages: Median: 161
- Publisher: Materials Research Society
- Publish Date: 2001
“Chemical-Mechanical Polishing 2000-Fundamentals and Materials Issues” Subjects and Themes:
- Subjects: Materials, research - Electrolytic polishing - Congresses - Grinding and polishing - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL12091966M
- Online Computer Library Center (OCLC) ID: 46521027
- Library of Congress Control Number (LCCN): 2001030693
- All ISBNs: 1558995218 - 9781558995215
Access and General Info:
- First Year Published: 2001
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
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17Chemical mechanical planarization VI
By International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (6th 2003 Orlando, Fla.)
“Chemical mechanical planarization VI” Metadata:
- Title: ➤ Chemical mechanical planarization VI
- Author: ➤ International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (6th 2003 Orlando, Fla.)
- Language: English
- Number of Pages: Median: 358
- Publisher: Electrochemical Society
- Publish Date: 2003
- Publish Location: Pennington, NJ
“Chemical mechanical planarization VI” Subjects and Themes:
- Subjects: ➤ Congresses - Grinding and polishing - Integrated circuits - Materials - Metals - Microelectronics - Pickling - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL3699495M
- Library of Congress Control Number (LCCN): 2003116456
- All ISBNs: 9781566774048 - 1566774047
Access and General Info:
- First Year Published: 2003
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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18Chemical mechanical planarization V
By International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia, Pa.)
“Chemical mechanical planarization V” Metadata:
- Title: ➤ Chemical mechanical planarization V
- Author: ➤ International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (5th 2002 Philadelphia, Pa.)
- Language: English
- Number of Pages: Median: 274
- Publisher: Electrochemical Society, Inc.
- Publish Date: 2002
- Publish Location: Pennington, NJ
“Chemical mechanical planarization V” Subjects and Themes:
- Subjects: ➤ Congresses - Grinding and polishing - Integrated circuits - Materials - Metals - Microelectronics - Pickling - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL3573860M
- Library of Congress Control Number (LCCN): 2002108247
- All ISBNs: 9781566773294 - 1566773296
Access and General Info:
- First Year Published: 2002
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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19Advanced interconnects and chemical mechanical planarization for micro- and nanoelectronics
By Symposium E, "Chemical Mechanical Planarization as a Semiconductor Technology Enabler," (2010 San Francisco, Calif.)
“Advanced interconnects and chemical mechanical planarization for micro- and nanoelectronics” Metadata:
- Title: ➤ Advanced interconnects and chemical mechanical planarization for micro- and nanoelectronics
- Author: ➤ Symposium E, "Chemical Mechanical Planarization as a Semiconductor Technology Enabler," (2010 San Francisco, Calif.)
- Language: English
- Number of Pages: Median: 342
- Publisher: Materials Research Society
- Publish Date: 2010
- Publish Location: Warrendale, Pa
“Advanced interconnects and chemical mechanical planarization for micro- and nanoelectronics” Subjects and Themes:
- Subjects: ➤ Nanoelectronics - Chemical mechanical planarization - Congresses - Microelectronics - Grinding and polishing - Nanotechnology
Edition Identifiers:
- The Open Library ID: OL30612468M
- Online Computer Library Center (OCLC) ID: 671870229
- Library of Congress Control Number (LCCN): 2012419928
- All ISBNs: 9781605112268 - 1605112267
Access and General Info:
- First Year Published: 2010
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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20Advances and challenges in chemical mechanical planarization
By Symposium C, "Advances and Challenges in Chemical Mechanical Planarization" (2007 San Francisco, Calif.)
“Advances and challenges in chemical mechanical planarization” Metadata:
- Title: ➤ Advances and challenges in chemical mechanical planarization
- Author: ➤ Symposium C, "Advances and Challenges in Chemical Mechanical Planarization" (2007 San Francisco, Calif.)
- Language: English
- Number of Pages: Median: 371
- Publisher: ➤ Materials Research Society, c2007.
- Publish Date: 2007
- Publish Location: Warrendale, Pa
“Advances and challenges in chemical mechanical planarization” Subjects and Themes:
- Subjects: ➤ Surfaces - Chemical mechanical planarization - Semiconductors - Congrès - Semiconducteurs - Materials - Congresses - Chimie des surfaces - Défauts - Grinding and polishing
Edition Identifiers:
- The Open Library ID: OL25176604M
- Online Computer Library Center (OCLC) ID: 181599360
- Library of Congress Control Number (LCCN): 2010540027
- All ISBNs: 1558999515 - 9781558999510
Access and General Info:
- First Year Published: 2007
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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21Advanced CMP processes for special substrates and for device manufacturing in MEMS applications
By Martin Kulawski
“Advanced CMP processes for special substrates and for device manufacturing in MEMS applications” Metadata:
- Title: ➤ Advanced CMP processes for special substrates and for device manufacturing in MEMS applications
- Author: Martin Kulawski
- Language: English
- Publisher: ➤ VTT Technical Research Centre of Finland
- Publish Date: 2006
- Publish Location: [Espoo, Finland]
“Advanced CMP processes for special substrates and for device manufacturing in MEMS applications” Subjects and Themes:
- Subjects: ➤ Sealing (Technology) - Microelectromechanical systems - Chemical mechanical planarization - Silicon-on-insulator technology - Thick films
Edition Identifiers:
- The Open Library ID: OL16149074M
- All ISBNs: 9513868559 - 9789513868550
Access and General Info:
- First Year Published: 2006
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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22Chemical mechanical planarization IV
By International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (4th 2000 Phoenix, Ariz.)
“Chemical mechanical planarization IV” Metadata:
- Title: ➤ Chemical mechanical planarization IV
- Author: ➤ International Symposium on Chemical Mechanical Planarization in Integrated Circuit Device Manufacturing (4th 2000 Phoenix, Ariz.)
- Language: English
- Number of Pages: Median: 338
- Publisher: Electrochemical Society, Inc.
- Publish Date: 2001
- Publish Location: Pennington, NJ
“Chemical mechanical planarization IV” Subjects and Themes:
- Subjects: ➤ Congresses - Grinding and polishing - Integrated circuits - Materials - Metals - Microelectronics - Pickling - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL3956765M
- Library of Congress Control Number (LCCN): 2001086381
- All ISBNs: 9781566772938 - 1566772931
Access and General Info:
- First Year Published: 2001
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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23Advances in Chemical-Mechanical Polishing
By Materials Research Society
“Advances in Chemical-Mechanical Polishing” Metadata:
- Title: ➤ Advances in Chemical-Mechanical Polishing
- Author: Materials Research Society
- Language: English
- Number of Pages: Median: 292
- Publisher: Materials Research Society
- Publish Date: 2004
“Advances in Chemical-Mechanical Polishing” Subjects and Themes:
- Subjects: Grinding and polishing - Materials - Electrolytic polishing - Congresses - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL12092031M
- Online Computer Library Center (OCLC) ID: 56811611
- Library of Congress Control Number (LCCN): 2005272466
- All ISBNs: 1558997660 - 9781558997660
Access and General Info:
- First Year Published: 2004
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
Online Borrowing:
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24Proceedings of the First International Symposium on Chemical Mechanical Planarization
By International Symposium on Chemical Mechanical Planarization (1st 1996 San Antonio, Tex.)
“Proceedings of the First International Symposium on Chemical Mechanical Planarization” Metadata:
- Title: ➤ Proceedings of the First International Symposium on Chemical Mechanical Planarization
- Author: ➤ International Symposium on Chemical Mechanical Planarization (1st 1996 San Antonio, Tex.)
- Language: English
- Number of Pages: Median: 275
- Publisher: Electrochemical Society
- Publish Date: 1997
- Publish Location: Pennington, NJ
“Proceedings of the First International Symposium on Chemical Mechanical Planarization” Subjects and Themes:
- Subjects: ➤ Congresses - Surfaces - Semiconductors - Pickling - Microelectronics - Metals - Materials - Grinding and polishing - Chemical mechanical planarization
Edition Identifiers:
- The Open Library ID: OL287241M
- Online Computer Library Center (OCLC) ID: 36930230
- Library of Congress Control Number (LCCN): 97190838
- All ISBNs: 1566771722 - 9781566771726
Access and General Info:
- First Year Published: 1997
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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25Science and technology of chemical mechanical planarization (CMP)
By Materials Research Society. Meeting Symposium E.
“Science and technology of chemical mechanical planarization (CMP)” Metadata:
- Title: ➤ Science and technology of chemical mechanical planarization (CMP)
- Author: ➤ Materials Research Society. Meeting Symposium E.
- Language: English
- Number of Pages: Median: 165
- Publisher: Materials Research Society
- Publish Date: 2010
- Publish Location: Warrendale, Penn
“Science and technology of chemical mechanical planarization (CMP)” Subjects and Themes:
- Subjects: ➤ Chemical mechanical planarization - Semiconductors - Congresses - Design and construction - Grinding and polishing
Edition Identifiers:
- The Open Library ID: OL25177912M
- Online Computer Library Center (OCLC) ID: 611870712
- Library of Congress Control Number (LCCN): 2011294342
- All ISBNs: 9781605111308 - 1605111309
Access and General Info:
- First Year Published: 2010
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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26Advances in CMP/polishing technologies for the manufacture of electronic devices
By Toshiro K. Doi, Ioan D. Marinescu and Syuhei Kurokawa
“Advances in CMP/polishing technologies for the manufacture of electronic devices” Metadata:
- Title: ➤ Advances in CMP/polishing technologies for the manufacture of electronic devices
- Authors: Toshiro K. DoiIoan D. MarinescuSyuhei Kurokawa
- Language: English
- Number of Pages: Median: 317
- Publisher: Elsevier - William Andrew
- Publish Date: 2012
- Publish Location: New York - Oxford
“Advances in CMP/polishing technologies for the manufacture of electronic devices” Subjects and Themes:
- Subjects: ➤ Electrolytic polishing - Grinding and polishing - Chemical mechanical planarization - TECHNOLOGY & ENGINEERING - Technical & Manufacturing Industries & Trades
Edition Identifiers:
- The Open Library ID: OL25253810M
- Online Computer Library Center (OCLC) ID: 740631119 - 774290238
- Library of Congress Control Number (LCCN): 2012359712
- All ISBNs: 9781437778595 - 1437778593
Access and General Info:
- First Year Published: 2012
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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27Nanoparticle engineering for chemical-mechanical planarization
By Ungyu Paik
“Nanoparticle engineering for chemical-mechanical planarization” Metadata:
- Title: ➤ Nanoparticle engineering for chemical-mechanical planarization
- Author: Ungyu Paik
- Language: English
- Publisher: Taylor & Francis
- Publish Date: 2009
- Publish Location: Boca Raton
“Nanoparticle engineering for chemical-mechanical planarization” Subjects and Themes:
- Subjects: ➤ Chemical mechanical planarization - Nanoelectronics - Nanoparticles
Edition Identifiers:
- The Open Library ID: OL22696275M
- Library of Congress Control Number (LCCN): 2008051282
- All ISBNs: 1420059114 - 9781420059113
Access and General Info:
- First Year Published: 2009
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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28Microelectronic applications of chemical mechanical planarization
“Microelectronic applications of chemical mechanical planarization” Metadata:
- Title: ➤ Microelectronic applications of chemical mechanical planarization
- Language: English
- Publisher: John Wiley
- Publish Date: 2007
- Publish Location: Hoboken, N.J
“Microelectronic applications of chemical mechanical planarization” Subjects and Themes:
- Subjects: ➤ Materials - Chemical mechanical planarization - Microelectronics - Integrated circuits - Design and construction
Edition Identifiers:
- The Open Library ID: OL17900692M
- Library of Congress Control Number (LCCN): 2007015557
- All ISBNs: 9780471719199 - 0471719196
Access and General Info:
- First Year Published: 2007
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
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