Explore: Reactive Ion Etching

Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet

Deep reactive-ion etching (DRIE) is a special subclass of reactive-ion etching (RIE). It enables highly anisotropic etch process used to create deep penetration

Reactive-ion etching (RIE) operates under conditions intermediate between sputter and plasma etching (between 10−3 and 10−1 Torr). Deep reactive-ion etching

individual atoms in an ion beam to ablate a target. Reactive ion etching is an important extension that uses chemical reactivity to enhance the physical

Such anisotropy is maximized in deep reactive ion etching (DRIE). The use of the term anisotropy for plasma etching should not be conflated with the use

side effect of reactive ion etching (RIE). Other methods for forming a similar structure include electrochemical etching, stain etching, metal-assisted

Look up rie in Wiktionary, the free dictionary. RIE may refer to: Reactive-ion etching, as an acronym Rie, a Japanese and Dutch given name The Royal Infirmary

for anisotropic deep-etching of diamond nanostructures by application of high bias in inductively coupled plasma/reactive ion etching (ICP/RIE) reactor.

(PFS) are promising as barrier materials in plasma-assisted reactive ion etching. Due to the presence of iron and silicon in the main chain, the polymer

of dry etching is reactive-ion etching. Unlike with many (but not all, see isotropic etching) of the wet chemical etchants used in wet etching, the dry