Explore: Planarisation Chimicomécanique
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Source: The Open Library
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1Nanoparticle engineering for chemical-mechanical planarization
By Ungyu Paik
“Nanoparticle engineering for chemical-mechanical planarization” Metadata:
- Title: ➤ Nanoparticle engineering for chemical-mechanical planarization
- Author: Ungyu Paik
- Language: English
- Number of Pages: Median: 222
- Publisher: ➤ CRC - Taylor & Francis - Taylor & Francis Group - CRC Press
- Publish Date: 2008 - 2009 - 2019
“Nanoparticle engineering for chemical-mechanical planarization” Subjects and Themes:
- Subjects: ➤ Nanoelectronics - Chemical mechanical planarization - Nanoparticles - Nanotechnology - Nanostructured materials - Microelectronics - Planarisation chimicomécanique - Nanoparticules - Nanoélectronique - SCIENCE / Chemistry / Industrial & Technical - TECHNOLOGY / Electronics / Microelectronics - TECHNOLOGY / Engineering / Chemical & Biochemical
Edition Identifiers:
- The Open Library ID: ➤ OL31367946M - OL29459429M - OL29459419M - OL33678548M - OL29034986M - OL33758029M - OL11816712M - OL29453036M
- Online Computer Library Center (OCLC) ID: 1104036011 - 277040881
- Library of Congress Control Number (LCCN): 2008051282
- All ISBNs: ➤ 9781420059137 - 0429291892 - 1420059114 - 1000013367 - 9781000023367 - 9781000006544 - 1000006549 - 100002329X - 9781000013368 - 9781420059113 - 1000023222 - 9781000023299 - 1420059130 - 9780429291890 - 1000023362 - 9781000023220
Access and General Info:
- First Year Published: 2008
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
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2Tribology in chemical-mechanical planarization
By Hong Liang, Hong Liang and David Craven
“Tribology in chemical-mechanical planarization” Metadata:
- Title: ➤ Tribology in chemical-mechanical planarization
- Authors: Hong LiangHong LiangDavid Craven
- Language: English
- Number of Pages: Median: 199
- Publisher: ➤ Taylor & Francis Group - Taylor & Francis - CRC
- Publish Date: 2005 - 2019
- Publish Location: Boca Raton, Fla
“Tribology in chemical-mechanical planarization” Subjects and Themes:
- Subjects: ➤ Tribology - Grinding and polishing - Technology: General Issues - Power Tools - Science - Home Improvement / Construction - Science/Mathematics - Engineering - General - Material Science - Technology / Material Science - Chemistry - General - Chemical mechanical planarization - Tribologie (Technologie) - Planarisation chimicomécanique - HOUSE & HOME
Edition Identifiers:
- The Open Library ID: ➤ OL22626705M - OL33699475M - OL34582674M - OL33435145M - OL34658550M - OL8125356M
- Online Computer Library Center (OCLC) ID: 56419342 - 77566887
- Library of Congress Control Number (LCCN): 2004058221
- All ISBNs: ➤ 0824725670 - 1420028391 - 128051678X - 0429120087 - 9780824725679 - 0367393255 - 9780367393250 - 9780429120084 - 9781280516788 - 9781420028393
First Setence:
"In the microelectronics community, the acronym CMP has been interpreted as either chemical-mechanical polishing or chemical-mechanical planarization."
Access and General Info:
- First Year Published: 2005
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Access
Downloads Are Not Available:
The book is not public therefore the download links will not allow the download of the entire book, however, borrowing the book online is available.
Online Borrowing:
Online Marketplaces
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3Advances in Chemical Mechanical Planarization (CMP)
By Suryadevara Babu
“Advances in Chemical Mechanical Planarization (CMP)” Metadata:
- Title: ➤ Advances in Chemical Mechanical Planarization (CMP)
- Author: Suryadevara Babu
- Language: English
- Number of Pages: Median: 536
- Publisher: Elsevier Science & Technology
- Publish Date: 2016
“Advances in Chemical Mechanical Planarization (CMP)” Subjects and Themes:
- Subjects: ➤ Semiconductors - Grinding and polishing - Chemical mechanical planarization - Nanoelectronics - Microelectronics - Miniaturization - Planarisation chimicomécanique - Nanoélectronique - Microélectronique - TECHNOLOGY & ENGINEERING - Mechanical
Edition Identifiers:
- The Open Library ID: OL28588268M - OL34509341M
- Online Computer Library Center (OCLC) ID: 934626626
- All ISBNs: 0081001657 - 9780081002186 - 9780081001653 - 0081002181
Access and General Info:
- First Year Published: 2016
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
Find Advances in Chemical Mechanical Planarization (CMP) at online marketplaces:
- Amazon: Audiable, Kindle and printed editions.
- Ebay: New & used books.