Explore: Circuits Intégrés Tridimensionnels
Discover books, insights, and more — all in one place.
Learn more about Circuits Intégrés Tridimensionnels with top reads curated from trusted sources — all in one place.
AI-Generated Overview About “circuits-int%C3%A9gr%C3%A9s-tridimensionnels”:
Books Results
Source: The Open Library
The Open Library Search Results
Search results from The Open Library
13D Integration in VLSI Circuits
By Katsuyuki Sakuma

“3D Integration in VLSI Circuits” Metadata:
- Title: ➤ 3D Integration in VLSI Circuits
- Author: Katsuyuki Sakuma
- Language: English
- Number of Pages: Median: 217
- Publisher: Taylor & Francis Group
- Publish Date: 2018 - 2021
“3D Integration in VLSI Circuits” Subjects and Themes:
- Subjects: ➤ Integrated circuits, very large scale integration - Three-dimensional integrated circuits - Integrated circuits - Very large scale integration - Circuits intégrés tridimensionnels - Circuits intégrés à très grande échelle - TECHNOLOGY & ENGINEERING - Mechanical - Computer engineering - Electronics
Edition Identifiers:
- The Open Library ID: ➤ OL33688741M - OL33635916M - OL33611936M - OL28904400M - OL33562018M - OL33920655M
- Online Computer Library Center (OCLC) ID: 1032611958
- Library of Congress Control Number (LCCN): 2020691836
- All ISBNs: ➤ 1351779818 - 1138710393 - 9781315200699 - 1351779834 - 9781351779814 - 9781351779838 - 1032095547 - 9781138710399 - 1351779826 - 9781351779821 - 9781032095547 - 1315200694
Access and General Info:
- First Year Published: 2018
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
Find 3D Integration in VLSI Circuits at online marketplaces:
- Amazon: Audiable, Kindle and printed editions.
- Ebay: New & used books.
2Design of 3D Integrated Circuits and Systems
By Rohit Sharma
“Design of 3D Integrated Circuits and Systems” Metadata:
- Title: ➤ Design of 3D Integrated Circuits and Systems
- Author: Rohit Sharma
- Language: English
- Number of Pages: Median: 324
- Publisher: Taylor & Francis Group
- Publish Date: 2014 - 2018 - 2020
“Design of 3D Integrated Circuits and Systems” Subjects and Themes:
- Subjects: ➤ Integrated circuits - Three-dimensional integrated circuits - Circuits intégrés tridimensionnels - TECHNOLOGY & ENGINEERING - Mechanical
Edition Identifiers:
- The Open Library ID: ➤ OL33725258M - OL33485820M - OL33757024M - OL28790687M - OL34681960M - OL33661750M
- Online Computer Library Center (OCLC) ID: 893735460
- Library of Congress Control Number (LCCN): 2014021624
- All ISBNs: ➤ 9781351822909 - 0367655926 - 9780367655921 - 9781315215709 - 1351831593 - 9781466589421 - 9781351831598 - 1315215705 - 135182290X - 1466589426 - 9781466589407 - 146658940X
Access and General Info:
- First Year Published: 2014
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
Find Design of 3D Integrated Circuits and Systems at online marketplaces:
- Amazon: Audiable, Kindle and printed editions.
- Ebay: New & used books.
3Through Silicon Vias
By Brajesh Kumar Kaushik, Arsalan Alam, Manoj Kumar Majumder and Vobulapuram Ramesh Kumar
“Through Silicon Vias” Metadata:
- Title: Through Silicon Vias
- Authors: Brajesh Kumar KaushikArsalan AlamManoj Kumar MajumderVobulapuram Ramesh Kumar
- Language: English
- Number of Pages: Median: 216
- Publisher: Taylor & Francis Group
- Publish Date: 2016 - 2020
“Through Silicon Vias” Subjects and Themes:
- Subjects: ➤ Interconnected electric utility systems - Integrated circuits - Engineering - Interconnects (Integrated circuit technology) - Three-dimensional integrated circuits - Interconnexions (Technologie des circuits intégrés) - Circuits intégrés tridimensionnels - TECHNOLOGY & ENGINEERING - Mechanical
Edition Identifiers:
- The Open Library ID: ➤ OL33628927M - OL30173688M - OL33586014M - OL33699050M - OL33667367M - OL28839374M
- Online Computer Library Center (OCLC) ID: 964699022
- All ISBNs: ➤ 9781315332758 - 131536882X - 1315332752 - 9781315351797 - 9781498745529 - 1498745520 - 131535179X - 9780367574543 - 9781315368825 - 0367574543 - 1498745539 - 9781498745536
Access and General Info:
- First Year Published: 2016
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
Find Through Silicon Vias at online marketplaces:
- Amazon: Audiable, Kindle and printed editions.
- Ebay: New & used books.
4Semiconducting Black Phosphorus
By Han Zhang, Nasir Mahmood Abbasi and Bing Wang

“Semiconducting Black Phosphorus” Metadata:
- Title: ➤ Semiconducting Black Phosphorus
- Authors: Han ZhangNasir Mahmood AbbasiBing Wang
- Language: English
- Number of Pages: Median: 240
- Publisher: ➤ CRC Press LLC - Taylor & Francis Group
- Publish Date: 2021
“Semiconducting Black Phosphorus” Subjects and Themes:
- Subjects: ➤ Three-dimensional integrated circuits - Materials - Semiconductors - Nanostructured materials - Phosphorus - Circuits intégrés tridimensionnels - Matériaux - Semi-conducteurs - Nanomatériaux - Phosphore - TECHNOLOGY / Electronics / Semiconductors
Edition Identifiers:
- The Open Library ID: OL36400372M - OL33932117M - OL33932097M - OL33932070M - OL35563333M
- Online Computer Library Center (OCLC) ID: 1269625486
- Library of Congress Control Number (LCCN): 2021035511
- All ISBNs: ➤ 9781032067636 - 1000463672 - 1032108053 - 9781032108056 - 1003217141 - 9781003217145 - 1032067632 - 9781000463644 - 9781000463675 - 1000463648
Access and General Info:
- First Year Published: 2021
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
Find Semiconducting Black Phosphorus at online marketplaces:
- Amazon: Audiable, Kindle and printed editions.
- Ebay: New & used books.
5Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
By Yue Ma and Christian Gontrand
“Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement” Metadata:
- Title: ➤ Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
- Authors: Yue MaChristian Gontrand
- Language: English
- Number of Pages: Median: 226
- Publisher: Taylor & Francis Group
- Publish Date: 2019
“Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement” Subjects and Themes:
- Subjects: ➤ Integrated circuits - Three-dimensional integrated circuits - Circuits intégrés tridimensionnels - TECHNOLOGY & ENGINEERING - Mechanical - COMPUTERS - Networking - General - TECHNOLOGY - Electricity - Electronics - Circuits
Edition Identifiers:
- The Open Library ID: OL33672430M - OL33736063M - OL33751820M - OL33672438M
- Online Computer Library Center (OCLC) ID: 1089727595
- All ISBNs: ➤ 9780429399619 - 0429680058 - 9780429680069 - 0429399618 - 0429680074 - 9780429680076 - 9780429680052 - 0429680066
Access and General Info:
- First Year Published: 2019
- Is Full Text Available: No
- Is The Book Public: No
- Access Status: No_ebook
Online Marketplaces
Find Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement at online marketplaces:
- Amazon: Audiable, Kindle and printed editions.
- Ebay: New & used books.