Explore: Bonding Processes

Ball bonding is a type of wire bonding, and is the most common way to make the electrical interconnections between a bare silicon die and the lead frame

together. Bonding is a mutual, interactive process, and is different from simple liking. It is the process of nurturing social connection. Bonding typically

liquid phase diffusion bonding is a process that differs from diffusion bonding. In transient liquid phase diffusion bonding, an element or alloy with

Adhesive bonding is a joining technique used in the manufacture and repair of a wide range of products. Along with welding and soldering, adhesive bonding is

melting temperature of the materials. A weak bond can also be achieved at room temperature. Diffusion bonding is usually implemented by applying high pressure

mechanics can also provide quantitative insight into ionic and covalent bonding processes by explicitly showing which molecules are energetically favorable

Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It

Emotional bonding theory first appeared in the mid-1970s and bonding theories outlining descriptions and causes of good bonding and poor bonding were established

although processes for bulk silicon wafer also have been created (SCREAM). Bonding a second wafer by glass frit bonding, anodic bonding or alloy bonding is

Laser bonding is a marking technique that uses lasers to bond an additive marking substance to a substrate. First invented in the mid 1990s by Essilor