Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Info and Reading Options
By Qingke Zhang
"Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces" was published by Springer in Nov 05, 2015 and it has 143 pages.
“Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces” Metadata:
- Title: ➤ Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
- Author: Qingke Zhang
- Number of Pages: 143
- Publisher: Springer
- Publish Date: Nov 05, 2015
“Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces” Subjects and Themes:
- Subjects: Joints (engineering)
Edition Specifications:
- Format: hardcover
Edition Identifiers:
- The Open Library ID: OL27992391M - OL20701882W
- ISBN-13: 9783662488218
- ISBN-10: 3662488213
- All ISBNs: 3662488213 - 9783662488218
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