Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces - Info and Reading Options
By Qingke Zhang
“Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces” Metadata:
- Title: ➤ Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
- Author: Qingke Zhang
“Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces” Subjects and Themes:
- Subjects: Joints (engineering)
Edition Identifiers:
- The Open Library ID: OL20701882W
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