Three-dimensional molded interconnect devices (3D-MID) - Info and Reading Options
materials, manufacturing, assembly, and applications for injection molded circuit carriers
By Franke, Jörg Dipl.-Ing
"Three-dimensional molded interconnect devices (3D-MID)" was published by Hanser Publishers in 2014 - Munich, it has 356 pages and the language of the book is English.
“Three-dimensional molded interconnect devices (3D-MID)” Metadata:
- Title: ➤ Three-dimensional molded interconnect devices (3D-MID)
- Author: Franke, Jörg Dipl.-Ing
- Language: English
- Number of Pages: 356
- Publisher: Hanser Publishers
- Publish Date: 2014
- Publish Location: Munich
“Three-dimensional molded interconnect devices (3D-MID)” Subjects and Themes:
- Subjects: ➤ Interconnects (Integrated circuit technology) - Design and construction - Injection molding of plastics - Integrated circuits - Plastics, molding - Matières plastiques - Moulage par injection - Injection molding - TECHNOLOGY & ENGINEERING - Mechanical - Electrical & Computer Engineering - Engineering & Applied Sciences - Electrical Engineering
Edition Specifications:
- Pagination: xii, 356 pages
Edition Identifiers:
- The Open Library ID: OL31017483M - OL23182470W
- Online Computer Library Center (OCLC) ID: 891586550 - 876833155 - 2014006403
- Library of Congress Control Number (LCCN): 2014006403
- ISBN-13: 9781569905517
- All ISBNs: 9781569905517
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