Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies - Info and Reading Options
By John H. Lau
"Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies" was published by McGraw-Hill in 1997 - New York, it has 408 pages and the language of the book is English.
“Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies” Metadata:
- Title: ➤ Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
- Author: John H. Lau
- Language: English
- Number of Pages: 408
- Publisher: McGraw-Hill
- Publish Date: 1997
- Publish Location: New York
“Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies” Subjects and Themes:
- Subjects: ➤ Testing - Multichip modules (Microelectronics) - Reliability - Solder and soldering - Microelectronic packaging
Edition Specifications:
- Pagination: xxi, 408 p. :
Edition Identifiers:
- The Open Library ID: OL992876M - OL3289763W
- Library of Congress Control Number (LCCN): 96031361
- ISBN-10: 0070366489
- All ISBNs: 0070366489
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