Solder joint reliability - Info and Reading Options
theory and applications
By John H. Lau
"Solder joint reliability" was published by Van Nostrand Reinhold in 1991 - New York, it has 631 pages and the language of the book is English.
“Solder joint reliability” Metadata:
- Title: Solder joint reliability
- Author: John H. Lau
- Language: English
- Number of Pages: 631
- Publisher: Van Nostrand Reinhold
- Publish Date: 1991
- Publish Location: New York
“Solder joint reliability” Subjects and Themes:
- Subjects: Welded joints - Solder and soldering - Microelectronics industry - American poetry - Mexican American authors
Edition Specifications:
- Pagination: xx, 631 p. :
Edition Identifiers:
- The Open Library ID: OL1859783M - OL18981797W
- Online Computer Library Center (OCLC) ID: 22703819
- Library of Congress Control Number (LCCN): 90012968 - 90023015
- ISBN-10: 0442002602
- All ISBNs: 0442002602
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