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"Semiconductor device modeling with SPICE" was published by McGraw-Hill in 1993 - New York, it has 479 pages and the language of the book is English.


“Semiconductor device modeling with SPICE” Metadata:

  • Title: ➤  Semiconductor device modeling with SPICE
  • Author:
  • Language: English
  • Number of Pages: 479
  • Publisher: McGraw-Hill
  • Publish Date:
  • Publish Location: New York

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  • Pagination: xiv, 479 p. :

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2Semiconductor device modeling with SPICE - Ebook

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  • Title: ➤  Semiconductor device modeling with SPICE - Ebook