RF Measurements of Die and Packages - Info and Reading Options
By Scott, A. Wartenberg

"RF Measurements of Die and Packages" was published by Artech House Publishers in June 15, 2002, it has 272 pages and the language of the book is English.
“RF Measurements of Die and Packages” Metadata:
- Title: ➤ RF Measurements of Die and Packages
- Author: Scott, A. Wartenberg
- Language: English
- Number of Pages: 272
- Publisher: Artech House Publishers
- Publish Date: June 15, 2002
“RF Measurements of Die and Packages” Subjects and Themes:
- Subjects: ➤ Very high speed integrated circuits - Measurements - Integrated circuits - Masks - Design and construction - Microelectronic packaging - Radio measurements
Edition Specifications:
- Format: Hardcover
- Weight: 1.1 pounds
- Dimensions: 9.3 x 6.4 x 0.8 inches
Edition Identifiers:
- The Open Library ID: OL8780170M - OL8941767W
- Library of Congress Control Number (LCCN): 2002016431
- ISBN-13: 9781580532730
- ISBN-10: 158053273X
- All ISBNs: 158053273X - 9781580532730
AI-generated Review of “RF Measurements of Die and Packages”:
Snippets and Summary:
Put simply, the goal of this book is to enable the reader to go into the lab and make better RF measurements.
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