Proceedings, 1997 IEEE Multi-Chip Module Conference - Info and Reading Options
February 4-5, 1997, Santa Cruz, California
By IEEE Multi-Chip Module Conference (1997 Santa Cruz, Calif.), IEEE Computer Society and Institute of Electrical and Electronics Engineers
"Proceedings, 1997 IEEE Multi-Chip Module Conference" was published by IEEE Computer Society Press in 1997 - Los Alamitos, Calif, it has 171 pages and the language of the book is English.
“Proceedings, 1997 IEEE Multi-Chip Module Conference” Metadata:
- Title: ➤ Proceedings, 1997 IEEE Multi-Chip Module Conference
- Authors: ➤ IEEE Multi-Chip Module Conference (1997 Santa Cruz, Calif.)IEEE Computer SocietyInstitute of Electrical and Electronics Engineers
- Language: English
- Number of Pages: 171
- Publisher: IEEE Computer Society Press
- Publish Date: 1997
- Publish Location: Los Alamitos, Calif
“Proceedings, 1997 IEEE Multi-Chip Module Conference” Subjects and Themes:
- Subjects: ➤ Congresses - Multichip modules (Microelectronics) - Neural networks (Computer science) - CAD/CAM systems - Thin films - Optoelectronic devices - Circuits & components - Computer Hardware & Operating Systems - Software engineering - Digital Computer Hardware - Integrated Circuits - Computers - Computers - General Information - Science/Mathematics - Computer Science - Computer Engineering
Edition Specifications:
- Pagination: x, 171 p. :
Edition Identifiers:
- The Open Library ID: OL19900157M - OL12925144W
- Online Computer Library Center (OCLC) ID: 36524697
- Library of Congress Control Number (LCCN): 96079698
- ISBN-10: 0818677899 - 0780339037
- All ISBNs: 0818677899 - 0780339037
AI-generated Review of “Proceedings, 1997 IEEE Multi-Chip Module Conference”:
"Proceedings, 1997 IEEE Multi-Chip Module Conference" Table Of Contents:
- 1- Session 1. Flip-chip I
- 2- Session II. Mixed signal MCMs
- 3- Session III. MCM design and CAD
- 4- Session IV: Panel: The best road to integration? Single chip or multi-chip?
- 5- Session V: Interconnect analysis and simulation
- 6- Session VI. Flip-chip II
- 7- Session VII. Test, technology and infrastructure
- 8- Session VIII: Optical MCMs
- 9- Session IX: Wrap up panel
- 10- Author index.
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