Photonics packaging and integration IV - Info and Reading Options
29 January 2003, San Jose, California, USA
By Ray T. Chen
"Photonics packaging and integration IV" was published by SPIE in 2004 - Bellingham, Wash., USA, it has 168 pages and the language of the book is English.
“Photonics packaging and integration IV” Metadata:
- Title: ➤ Photonics packaging and integration IV
- Author: Ray T. Chen
- Language: English
- Number of Pages: 168
- Publisher: SPIE
- Publish Date: 2004
- Publish Location: Bellingham, Wash., USA
“Photonics packaging and integration IV” Subjects and Themes:
- Subjects: ➤ Congresses - Photonics - Optical interconnects - Optoelectronic devices - Microelectronic packaging - Design and construction - Electronic packaging
Edition Specifications:
- Pagination: vii, 168 p. :
Edition Identifiers:
- The Open Library ID: OL3329129M - OL19171628W
- Online Computer Library Center (OCLC) ID: 55872492
- Library of Congress Control Number (LCCN): 2004304108
- ISBN-10: 0819452661
- All ISBNs: 0819452661
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