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"NASA Technical Reports Server (NTRS) 20140004927: Packaging Technologies For High Temperature Electronics And Sensors" and the language of the book is English.


“NASA Technical Reports Server (NTRS) 20140004927: Packaging Technologies For High Temperature Electronics And Sensors” Metadata:

  • Title: ➤  NASA Technical Reports Server (NTRS) 20140004927: Packaging Technologies For High Temperature Electronics And Sensors
  • Author: ➤  
  • Language: English

Edition Identifiers:

  • Internet Archive ID: NASA_NTRS_Archive_20140004927

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"NASA Technical Reports Server (NTRS) 20140004927: Packaging Technologies For High Temperature Electronics And Sensors" Description:

The Internet Archive:

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

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  • Source: Internet Archive
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  • Added Date: 2016-11-14 17:58:37
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