Materials, technology and reliability for advanced interconnects and low-k dielectrics, 2003 - Info and Reading Options
symposium held April 21-25, 2003, San Francisco, California, U.S.A
By Symposim E, "Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics" (2003 San Francisco, Calif.)
"Materials, technology and reliability for advanced interconnects and low-k dielectrics, 2003" was published by Materials Research Society in 2003 - Warrendale, Pa, it has 515 pages and the language of the book is English.
“Materials, technology and reliability for advanced interconnects and low-k dielectrics, 2003” Metadata:
- Title: ➤ Materials, technology and reliability for advanced interconnects and low-k dielectrics, 2003
- Author: ➤ Symposim E, "Materials, Technology, and Reliability for Advanced Interconnects and Low-k Dielectrics" (2003 San Francisco, Calif.)
- Language: English
- Number of Pages: 515
- Publisher: Materials Research Society
- Publish Date: 2003
- Publish Location: Warrendale, Pa
“Materials, technology and reliability for advanced interconnects and low-k dielectrics, 2003” Subjects and Themes:
- Subjects: ➤ Congresses - Dielectric films - Integrated circuits - Junctions - Materials - Reliability - Semiconductors
Edition Specifications:
- Pagination: xv, 515 p. :
Edition Identifiers:
- The Open Library ID: OL3321245M - OL5749839W
- Online Computer Library Center (OCLC) ID: 53783095
- Library of Congress Control Number (LCCN): 2004273845
- ISBN-10: 1558997032
- All ISBNs: 1558997032
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