Materials, technology and reliability for advanced interconnects--2005 - Info and Reading Options
symposium held March 28-April 1, 2005, San Francisco, California, U.S.A
By Paul R. Besser and C. P. Wong
"Materials, technology and reliability for advanced interconnects--2005" was published by Materials Research Society in 2005 - Warrendale, Pa, it has 411 pages and the language of the book is English.
“Materials, technology and reliability for advanced interconnects--2005” Metadata:
- Title: ➤ Materials, technology and reliability for advanced interconnects--2005
- Authors: Paul R. BesserC. P. Wong
- Language: English
- Number of Pages: 411
- Publisher: Materials Research Society
- Publish Date: 2005
- Publish Location: Warrendale, Pa
“Materials, technology and reliability for advanced interconnects--2005” Subjects and Themes:
- Subjects: ➤ Materials - Congresses - Junctions - Reliability - Dielectric films - Semiconductors - Integrated circuits - Thin films
Edition Specifications:
- Pagination: xiii, 411 p. :
Edition Identifiers:
- The Open Library ID: OL22729375M - OL19379254W
- Online Computer Library Center (OCLC) ID: 61658459
- Library of Congress Control Number (LCCN): 2006280122
- ISBN-10: 1558998160
- All ISBNs: 1558998160
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