Integrated circuit, hybrid, and multichip module package design guidelines - Info and Reading Options
a focus on reliability
By Michael Pecht
"Integrated circuit, hybrid, and multichip module package design guidelines" was published by Wiley in 1994 - New York, it has 426 pages and the language of the book is English.
“Integrated circuit, hybrid, and multichip module package design guidelines” Metadata:
- Title: ➤ Integrated circuit, hybrid, and multichip module package design guidelines
- Author: Michael Pecht
- Language: English
- Number of Pages: 426
- Publisher: Wiley
- Publish Date: 1994
- Publish Location: New York
“Integrated circuit, hybrid, and multichip module package design guidelines” Subjects and Themes:
- Subjects: ➤ Multichip modules (Microelectronics) - Hybrid integrated circuits - Electronic packaging - Design - Design and construction - Integrated circuits
Edition Specifications:
- Pagination: xxxi, 426 p. :
Edition Identifiers:
- The Open Library ID: OL1404346M - OL18956705W
- Online Computer Library Center (OCLC) ID: 27683155
- Library of Congress Control Number (LCCN): 93012475
- ISBN-10: 0471594466
- All ISBNs: 0471594466
AI-generated Review of “Integrated circuit, hybrid, and multichip module package design guidelines”:
"Integrated circuit, hybrid, and multichip module package design guidelines" Description:
The Open Library:
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals. Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost; define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data; identify potential failure modes, sites, mechanisms, and architecture-stress interactions - PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures; characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved; and use experiment, step-stress, and accelerated methods to ensure optimum design before production begins.
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