Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages - Info and Reading Options
By P. E. Tegehall
"Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages" was published by ESA Publications Division in 2003 - Noordwijk, it has 40 pages and the language of the book is English.
“Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages” Metadata:
- Title: ➤ Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages
- Author: P. E. Tegehall
- Language: English
- Number of Pages: 40
- Publisher: ESA Publications Division
- Publish Date: 2003
- Publish Location: Noordwijk
“Impact of cracking beneath solder pads in printed board laminate on reliability of solder joints to ceramic ball grid array packages” Subjects and Themes:
- Subjects: Ball grid array technology
Edition Specifications:
- Pagination: iv, 40 p.
Edition Identifiers:
- The Open Library ID: OL31586160M - OL23869638W
- Online Computer Library Center (OCLC) ID: 52474423
- Library of Congress Control Number (LCCN): 2003504225
- ISBN-10: 9290923628
- All ISBNs: 9290923628
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