Electromigration in thin films and electronic devices - Info and Reading Options
materials and reliability
By Choong-Un Kim
"Electromigration in thin films and electronic devices" was published by Woodhead Publishing in 2011 - Oxford, it has 340 pages and the language of the book is English.
“Electromigration in thin films and electronic devices” Metadata:
- Title: ➤ Electromigration in thin films and electronic devices
- Author: Choong-Un Kim
- Language: English
- Number of Pages: 340
- Publisher: Woodhead Publishing
- Publish Date: 2011
- Publish Location: Oxford
“Electromigration in thin films and electronic devices” Subjects and Themes:
- Subjects: ➤ Electrodiffusion - Integrated circuits - Deterioration - Thin films - Interconnects (Integrated circuit technology) - Diffusion - Couches minces - TECHNOLOGY & ENGINEERING - Mechanical
Edition Specifications:
- Pagination: xiii, 340 p. :
Edition Identifiers:
- The Open Library ID: OL25214345M - OL16521129W
- Online Computer Library Center (OCLC) ID: 713610407 - 880416293 - 758543100
- Library of Congress Control Number (LCCN): 2011934923
- ISBN-13: 9781845699376 - 9780857093752
- ISBN-10: 1845699378
- All ISBNs: 1845699378 - 9781845699376 - 9780857093752
AI-generated Review of “Electromigration in thin films and electronic devices”:
"Electromigration in thin films and electronic devices" Table Of Contents:
- 1- Part I. Introduction. Modeling electromigration phenomena / F. Cacho and X. Federspiel ; Modeling electromigratoin using the peridynamics approach / D.T. Read and V.K. Tewary and W.H. Gerstle ; Modeling, simulation and X-ray microbeam studies of electromigration / A.M. Maniatty, G.S. Cargill III, and H. Zhang
- 2- Part II. Electromigration in copper interconnects. X-ray microbeam analysis of electromigration in copper inteerconnects / H. Zhang and G.S. Cargill III ; Voiding in copper interconnects during electromigration / C.L. Gan and M.K. Lim ; The evolution of microstructure in copper interconnects during electromigration / A.S> Budiman ; Scaling effects on electromigration reliability of copper interconnects / L. Zhang, J.W. Pyun, and P.S. Ho ; Electromigration failure in nanoscale copper interconnects / E.T. Ogawa
- 3- Part III. Electromigration in solder. Electromigration-induced microstructural evolution in lead-free and lead-tin solders / K.-L. Lin ; Electromigration in flip-chip solder joints / D. Yang and Y.C. Chan and M. Pecht.
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