Electrical Modeling and Design for 3D System Integration
3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
By Er-Ping Li
"Electrical Modeling and Design for 3D System Integration" is published by Wiley & Sons, Incorporated, John in 2012 - Hoboken, it has 1 pages and the language of the book is English.
“Electrical Modeling and Design for 3D System Integration” Metadata:
- Title: ➤ Electrical Modeling and Design for 3D System Integration
- Author: Er-Ping Li
- Language: English
- Number of Pages: 1
- Publisher: ➤ Wiley & Sons, Incorporated, John
- Publish Date: 2012
- Publish Location: Hoboken
“Electrical Modeling and Design for 3D System Integration” Subjects and Themes:
- Subjects: Electromagnetic devices
Edition Specifications:
- Pagination: 384
Edition Identifiers:
- The Open Library ID: OL48710104M - OL21470486W
- ISBN-13: 9781118166727 - 9781118166758
- All ISBNs: 9781118166727 - 9781118166758
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