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"DTIC ADA283613: Advanced Packaging And Integration Technologies For Microsensors. Phase 1" and the language of the book is English.


“DTIC ADA283613: Advanced Packaging And Integration Technologies For Microsensors. Phase 1” Metadata:

  • Title: ➤  DTIC ADA283613: Advanced Packaging And Integration Technologies For Microsensors. Phase 1
  • Author: ➤  
  • Language: English

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  • Internet Archive ID: DTIC_ADA283613

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"DTIC ADA283613: Advanced Packaging And Integration Technologies For Microsensors. Phase 1" Description:

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Advanced microfabrication processes have been developed for producing a hermetic cover wafer with low resistance dielectrically isolated through-wafer interconnects. The feasibility of manufacturing encapsulated pressure sensors, utilizing the cover-wafer approach, has been demonstrated. Such pressure sensors represent a new generation of environmentally protected, cost effective devices. The accomplishments of Phase I include the following: the study of conversion of single crystal silicon into porous silicon; the study of conversion of porous silicon into oxide; process for producing through-wafer interconnects has been established; the stresses in the cover wafer have been investigated, which enabled the fabrication of flat cover-wafers. The surface and cross-sectional morphology of the cover wafer was investigated; hermeticity and dielectric isolation of the oxidized rings was verified; Sensors compatible with the cover- wafer approach were fabricated and tested. The new generation of sensors was designed

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"DTIC ADA283613: Advanced Packaging And Integration Technologies For Microsensors. Phase 1" is available for download from The Internet Archive in "texts" format, the size of the file-s is: 21.89 Mbs, and the file-s went public at Mon Mar 19 2018.

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  • Source: Internet Archive
  • Internet Archive Link: Archive.org page
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  • Added Date: 2018-03-19 21:19:27
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