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Real Time Approach To Process Control by William Y. Svrcek

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1NASA Technical Reports Server (NTRS) 19720000643: An Approach To Real-time Process Control Of Semiconductor Wire-bonding

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Thermal probe using infrared-transparent optical fiber attached to tip of collet with resin to prevent movement during bonding is used to accurately measure temperature during wire bonding on semiconductors for use in large scale integrated circuits.

“NASA Technical Reports Server (NTRS) 19720000643: An Approach To Real-time Process Control Of Semiconductor Wire-bonding” Metadata:

  • Title: ➤  NASA Technical Reports Server (NTRS) 19720000643: An Approach To Real-time Process Control Of Semiconductor Wire-bonding
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  • Language: English

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The book is available for download in "texts" format, the size of the file-s is: 1.27 Mbs, the file-s for this book were downloaded 73 times, the file-s went public at Fri Jul 08 2016.

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