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Dtic Ada277686%3a Seta Support For The Darpa Microelectronics Technology Insertion Program Of The Microelectronics Technology Office by Defense Technical Information Center

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1DTIC ADA277686: SETA Support For The DARPA Microelectronics Technology Insertion Program Of The Microelectronics Technology Office

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Booz-Allen & Hamilton provides DARPA's Microelectronics Technology Office with a broad range of SETA support under contract MDA972-92-C-0029. This report describe activities during the first quarter of this contract. The main programs supported were: the Digital Gallium Arsenide Insertion Program, the Transition of Optical Processors to Systems (TOPS), the Microelectronics Manufacturing Strategy (MMST) Program, the Flexible, Intelligent Microelectronics Manufacturing Program (FIMM),and the Artificial Neural Networks Technology Program (ANNT). In addition, support was begun to a new High Speed Circuit Design Program. This report is organized by subtask areas in the statement of work, indicating for each subtask the Task Objectives, General Methodology, Technical Results, and Important Findings and Conclusions. The final section of this report presents a summary and conclusions, and the appendices present trip reports, meeting schedules, and some viewgraphs generated during this quarter of the contract.

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  • Title: ➤  DTIC ADA277686: SETA Support For The DARPA Microelectronics Technology Insertion Program Of The Microelectronics Technology Office
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  • Language: English

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