Design, process integration, and characterization for microelectronics - Info and Reading Options
6-7 March 2002, Santa Clara, USA
"Design, process integration, and characterization for microelectronics" was published by SPIE in 2002 - Bellingham, Wash, it has 628 pages and the language of the book is English.
“Design, process integration, and characterization for microelectronics” Metadata:
- Title: ➤ Design, process integration, and characterization for microelectronics
- Language: English
- Number of Pages: 628
- Publisher: SPIE
- Publish Date: 2002
- Publish Location: Bellingham, Wash
“Design, process integration, and characterization for microelectronics” Subjects and Themes:
- Subjects: ➤ Semiconductor wafers - Characterization - Semiconductors - Microelectronics industry - Analysis - Design and construction - Quality control - Congresses - Defects - Integrated circuits - Microelectronics
Edition Specifications:
- Pagination: xv, 628 p. :
Edition Identifiers:
- The Open Library ID: OL3657674M - OL19599993W
- Online Computer Library Center (OCLC) ID: 50514162
- Library of Congress Control Number (LCCN): 2002512515
- ISBN-10: 0819444391
- All ISBNs: 0819444391
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