Bonding in Microsystem Technology - Info and Reading Options
By Jan A. Dziuban
"Bonding in Microsystem Technology" is published by Springer in July 26, 2006, it has 331 pages and the language of the book is English.
“Bonding in Microsystem Technology” Metadata:
- Title: ➤ Bonding in Microsystem Technology
- Author: Jan A. Dziuban
- Language: English
- Number of Pages: 331
- Publisher: Springer
- Publish Date: July 26, 2006
“Bonding in Microsystem Technology” Subjects and Themes:
- Subjects: ➤ Micromachining - Microtechnology - Electronics - Materials - Structural control (Engineering) - Engineering - Optical materials - Microelectronics
Edition Specifications:
- Format: Hardcover
- Weight: 1.2 pounds
- Dimensions: 9.5 x 6.3 x 0.8 inches
Edition Identifiers:
- The Open Library ID: OL9547495M - OL9220771W
- Library of Congress Control Number (LCCN): 2007440844
- ISBN-13: 9781402045783
- ISBN-10: 1402045786
- All ISBNs: 1402045786 - 9781402045783
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