Adhesion aspects in MEMS-NEMS - Info and Reading Options
By Seong H. Kim, Michael T. Dugger and K. L. Mittal
"Adhesion aspects in MEMS-NEMS" was published by Brill in 2010 - Leiden, it has 409 pages and the language of the book is English.
“Adhesion aspects in MEMS-NEMS” Metadata:
- Title: Adhesion aspects in MEMS-NEMS
- Authors: Seong H. KimMichael T. DuggerK. L. Mittal
- Language: English
- Number of Pages: 409
- Publisher: Brill
- Publish Date: 2010
- Publish Location: Leiden
“Adhesion aspects in MEMS-NEMS” Subjects and Themes:
- Subjects: ➤ Nanoelectromechanical systems - Microelectromechanical systems - Surfaces (Technology) - Adhesion - Surfaces (technology) - Nanostructures - Micro-Electrical-Mechanical Systems - Adhesiveness - Microsystèmes électromécaniques - Nanosystèmes électromécaniques - Adhésion (Physique) - Surfaces (Technologie) - TECHNOLOGY & ENGINEERING - Electronics - Digital - Microelectronics
Edition Specifications:
- Pagination: xi, 409 p. :
Edition Identifiers:
- The Open Library ID: OL25203392M - OL16506917W
- Online Computer Library Center (OCLC) ID: 665139130 - 824353879
- Library of Congress Control Number (LCCN): 2011377691
- ISBN-13: 9789004190948
- ISBN-10: 9004190945
- All ISBNs: 9004190945 - 9789004190948
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